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	STUDY ON DE-EMBEDDING APPROACH OF NON-COAXIAL MICROWAVE DEVICE TEST FIXTURES
	Chen, Shouhong[1]; Yang, Ping[2]; Ma, Jun[3]; Wang, Zhuang[4]; Yan, Xuelong[5]
	2018
会议名称	2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
会议日期	2018-01-01
关键词	TRL Algorithm S Parameter RF device testing
页码	1666-1670
收录类别	CPCI-S
URL标识	查看原文
WOS记录号	WOS:000450155700366
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/5330429
专题	江苏大学
作者单位	1.[1]Jiangsu Univ, Sch Mech Engn, Lab Adv Design Mfg & Reliabil, MEMS,NEMS,ODES, Zhenjiang, Peoples R China. 2.Guilin Univ Elect Technol, Guangxi Key Lab Automat Detecting Technol & Instr, Sch Elect Engn & Automat, Guilin, Peoples R China. 3.[2]Jiangsu Univ, Sch Mech Engn, Lab Adv Design Mfg & Reliabil, MEMS,NEMS,ODES, Zhenjiang, Peoples R China. 4.[3]Guilin Univ Elect Technol, Guangxi Key Lab Automat Detecting Technol & Instr, Sch Elect Engn & Automat, Guilin, Peoples R China. 5.[4]Guilin Univ Elect Technol, Sch Elect Engn & Automat, Guilin, Peoples R China. 6.[5]Guilin Univ Elect Technol, Sch Elect Engn & Automat, Guilin, Peoples R China.
推荐引用方式 GB/T 7714	Chen, Shouhong[1],Yang, Ping[2],Ma, Jun[3],et al. STUDY ON DE-EMBEDDING APPROACH OF NON-COAXIAL MICROWAVE DEVICE TEST FIXTURES[C]. 见:2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2018-01-01.

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