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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effect of precipitation of (Ti,V)N and V(C,N) secondary phases on mechanical properties of V and N microalloyed 1Cr steels 期刊论文 MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2018, 卷号: 738, 页码: 203-212 作者:  Zhang, Z. H.[1];  Liu, Y.[2];  Zhou, Y. N.[3];  Dong, X. M.[4];  Zhang, C. X.[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/22 Steels  Microstructure  Mechanical properties  Precipitation strengthening  Electron microscopy   Preparation of -alumina/silica core-shell abrasives and their chemical mechanical polishing performances on sapphire substrates 期刊论文 MICRO & NANO LETTERS, 2018, 卷号: 13, 页码: 1315-1320 作者:  Wang, Xin[1];  Lei, Hong[2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22 scanning electron microscopy  abrasives  surface roughness  friction  X-ray photoelectron spectra  abrasion  secondary ion mass spectra  silicon compounds  alumina  transmission electron microscopy  chemical mechanical polishing  composite materials  materials preparation  time of flight mass spectra  surface morphology  sapphire  core-shell structure  time-of-flight secondary ion mass spectroscopy  scanning electron microscopy  transmission electron microscopy  sapphire substrates  che   Preparation of cobalt-doped colloidal silica abrasives and their chemical mechanical polishing performances on sapphire 期刊论文 MICRO & NANO LETTERS, 2015, 卷号: 10, 页码: 657-661 作者:  Ma, Pan[1];  Lei, Hong[2];  Chen, Ruling[3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 silicon compounds  cobalt  abrasives  time of flight mass spectra  secondary ion mass spectra  scanning electron microscopy  chemical mechanical polishing  surface roughness  atomic emission spectroscopy  X-ray photoelectron spectra  cobalt-doped colloidal silica abrasives  chemical mechanical polishing  seed-induced growth  time-of-flight secondary ion mass spectroscopy  scanning electron microscopy  CMP  sapphire substrates  surface roughness  material removal rate  inductively couple