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Thermal atomic layer deposition of TaAlC with TaCl5 and TMA as precursors 期刊论文
ECS Journal of Solid State Science and Technology, 2016
作者:  Xiang JJ(项金娟)
收藏  |  浏览/下载:7/0  |  提交时间:2017/05/09
Investigation of N type metal TiAlC by thermal atomic layer deposition using TiCl4 and TEA as precursors 期刊论文
ECS Journal of Solid State Science and Technology, 2016
作者:  Xiang JJ(项金娟);  Li TT(李亭亭);  Wang XL(王晓磊);  Li JF(李俊峰)
收藏  |  浏览/下载:12/0  |  提交时间:2017/05/09
Application of Atomic Layer Deposition Tungsten (ALD W) as gate filling metal for 22 nm and beyond nodes CMOS technology 期刊论文
ECS Transactions, 2013
作者:  Xu Q(徐强);  Wang GL(王桂磊);  Yang T(杨涛)
收藏  |  浏览/下载:13/0  |  提交时间:2014/10/30


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