QQ客服 官方微博 反馈留言

浏览/检索结果: 共5条，第1-5条 帮助 限定条件 内容类型：其他     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他 2016-01-01 Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 Air-gapped Si  Si interposer  low stress  hermetical  System-in-Package  MEMS  WAFER-LEVEL  MEMS RESONATORS  TSV INTERPOSERS  VACUUM  MEMBRANES  DEVICES  SENSORS   Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device 其他 2016-01-01 Ma, Shenglin; Ren, Kuili; Xia, Yanming; Yan, Jun; Luo, Rongfeng; Cai, Han; Jin, Yufeng; Ma, Mingjun; Jin, Zhonghe; Chen, Jing 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 TGV interposer  Al RDL  Wafer level packaging  Inertial devices   Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer 其他 2016-01-01 Xia, Yanming; Ren, Kuili; Ma, Shenglin; Guan, Yong; Cai, Han; Luo, Rongfeng; Yan, Jun; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 petaloid hollow Cu interconnection  3D TSV interposer  thermal-mechanical simulation  influence on electrical property   Process Development of Thick Si Interposer for 2.5D Integration of RF MEMS Devices 其他 2016-01-01 Ren, Kuili; Ma, Shenglin; Ma, Feilong; Yan, Jun; Xia, Yanming; Luo, Rongfeng; Jin, Yufeng; Chen, Jing 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 Thick TSV interposer  high resistivity Si  CPW  Micro-strip  inductor   Process Development of Through-Glass-Via (TGV) Interposer for Radio Frequency (RF) Applications 其他 2016-01-01 Yan, Jun; Ma, Shenglin; Ma, Feilong; Xia, Yanming; Luo, Rongfeng; Jin, Yufeng; Chen, Jing 收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03 TGVinterposer  RF  Electrical property