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科研机构
金属研究所 [8]
沈阳应用生态研究所 [1]
内容类型
期刊论文 [9]
发表日期
2018 [4]
2017 [4]
2008 [1]
学科主题
Metallurgy... [9]
Materials ... [7]
Chemistry,... [5]
Materials ... [1]
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学科主题:Metallurgy & Metallurgical Engineering
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The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
作者:
Tian, FF
;
Li, CF
;
Zhou, M
;
Liu, ZQ
;
Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2018/06/05
Heterogeneous Binary-systems
Chemical-compound Layers
2 Elementary Substances
Eutectic Snin Solder
Intermetallic Compounds
Phase Identification
Reaction-diffusion
Growth-kinetics
Joint
Transformations
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:
Gao, LY
;
Li, CF
;
Wan, P
;
Zhang, H
;
Liu, ZQ
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  |  
浏览/下载:24/0
  |  
提交时间:2018/06/05
Lead-free Solders
Interfacial Reactions
Sn-ag
Intermetallic Compounds
Rich Solders
Joints
Growth
Reliability
Substrate
Strength
The facile synthesis, crystallization behavior and magnetic property of FeNiP amorphous nanoparticles
期刊论文
MATERIALS CHARACTERIZATION, 2018, 卷号: 136, 页码: 94-99
作者:
Yuan, J
;
Li, CF
;
Yang, B
;
Liu, ZQ
;
Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.
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  |  
浏览/下载:15/0
  |  
提交时间:2018/06/05
High Saturation Magnetization
Interfacial Reliability
Alloys
Temperature
Fabrication
Relaxation
Effect of Annealing on Properties of AgCuNiCe/TU1 Rolling Clad Sheet
期刊论文
TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS, 2018, 卷号: 71, 期号: 1, 页码: 253-256
作者:
Li, YH
;
Liang, XJ
;
Li, JG
;
Wang, J
;
Li, YH (reprint author), Shenyang Ligong Univ, Sch Mat Sci & Engn, Shenyang 110159, Liaoning, Peoples R China.
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  |  
浏览/下载:12/0
  |  
提交时间:2018/06/05
Alloy
Diamond/beta-SiC film as adhesion-enhanced interlayer for top diamond coatings on cemented tungsten carbide substrate
期刊论文
JOURNAL MATER SCI TECHNOL, 2017, 卷号: 33, 期号: 10, 页码: 1097-1106
作者:
Tian, Qingquan
;
Huang, Nan
;
Yang, Bing
;
Zhuang, Hao
;
Wang, Chun
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  |  
浏览/下载:31/0
  |  
提交时间:2018/01/10
Diamond/beta-sic
Interlayer
Microstructure
Adhesion
Mpcvd
Transformation Mechanism of (gamma plus gamma') and the Effect of Cooling Rate on the Final Solidification of U720Li Alloy
期刊论文
CHINESE ACAD SCIENCES, INST METAL RESEARCH, 2017, 卷号: 30, 期号: 9, 页码: 887-894
作者:
Zhao, Guang-Di
;
Yang, Guo-Liang
;
Liu, Fang
;
Xin, Xin
;
Sun, Wen-Ru
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  |  
浏览/下载:21/0
  |  
提交时间:2018/01/10
U720li
(Gamma Plus Gamma') Formation Mechanism
Cooling Rate
Solidification
Electromigration anisotropy introduced by tin orientation in solder joints
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271
Chen, Jian-Qiang
;
Liu, Kai-Lang
;
Guo, Jing-Dong
;
Ma, Hui-Cai
;
Wei, Song
;
Shang, Jian-Ku
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  |  
浏览/下载:22/0
  |  
提交时间:2017/08/17
Electromigration
Single crystal tin
Cu6Sn5
Intermetallic compounds
Orientation
Diffusion
The relation between wetting and interfacial chemistry in the Zr-Based BMGs/W system
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 690, 页码: 903-908
Ma, G. F.
;
Ye, H.
;
Zhang, H. L.
;
He, C. L.
;
Sun, L. N.
;
Zhang, H. F.
;
Hu, Z. Q.
收藏
  |  
浏览/下载:56/0
  |  
提交时间:2017/08/17
Wetting
Interface
W
Zr-based BMG
Nb
Wetting behavior and interfacial characteristics of In-Sn alloy on CuZr-based bulk metallic glass
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 卷号: 464, 期号: 1-2, 页码: 248-251
作者:
Ma, GF
;
Zhang, HL
;
Zhang, HF
;
Li, H
;
Hu, ZQ
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2011/09/23
Wettability
Interface
Diffusion
Reaction
Bmg
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