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期刊论文 [38]
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Effect of Cooling Rate on Microstructure and Effective Grain Size for a Ni-Cr-Mo-B High-Strength Steel
期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:
Zhang, Shouqing
;
Hu, Xiaofeng
;
Jiang, Haichang
;
Rong, Lijian
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2022/07/14
Ni-Cr-Mo-B steel
Cooling rate
Microstructural characterization
Effective grain size (EGS)
Microstructure characterization and texture evolution of Ti-6Al-4V cladding layer fabricated by alterative current assisted TIG
期刊论文
Surface and Coatings Technology, 2022, 卷号: 431
作者:
Huang, Yanqin
;
Huang, Jiankang
;
Yu, Xiaoquan
;
Yu, Shurong
;
Fan, Ding
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2022/06/20
Cladding (coating)
Electric impedance
Electric impedance measurement
Grain growth
Grain size and shape
Microstructural evolution
Ternary alloys
Textures
Titanium alloys
Transmission electron microscopy
'current
Alternating current
Alternative current
Cladding layer
Grainsize
Microstructure characterization
Microstructure-texture
Texture evolutions
Ti-6al-4v
Twin
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder
期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2021/02/02
Sn nanowire
Template electrodeposition
Microstructural characterization
Liquid bath melting
Lead-free solder
Melting point
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder
期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2021/02/02
Sn nanowire
Template electrodeposition
Microstructural characterization
Liquid bath melting
Lead-free solder
Melting point
Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330
作者:
Zhang, Xudong
;
Hu, Xiaowu
;
Jiang, Xiongxin
;
Zhou, Liuru
;
Li, Qinglin
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  |  
浏览/下载:11/0
  |  
提交时间:2020/06/16
Additives
Atomic force microscopy
Binary alloys
Chlorine compounds
Copper
Copper compounds
Electron probe microanalysis
Electrons
High resolution transmission electron microscopy
Metallic films
Scanning electron microscopy
Tin alloys
Tin metallography
X ray photoelectron spectroscopy
Crystallographic orientations
Electron back scatter diffraction
Electroplated copper film
Electroplated Cu films
Impurity incorporation
Micro-structural characterization
Microstructural instability
Plating solutions
Structure evaluation of anode-supported planar solid oxide fuel cells based on single/double-sided electrolyte(s) under redox conditions
期刊论文
INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY, 2020, 卷号: 17, 期号: 3, 页码: 1314-1321
作者:
Liu, Wu
;
Zheng, Jiahong
;
Wang, Yudong
;
Jiang, Congying
;
Li, Dongfeng
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2020/12/16
MICROSTRUCTURAL CHARACTERIZATION
OXIDATION BEHAVIOR
SOFC
REDUCTION
INTERFACE
ADHESION
STRENGTH
A promising new class of irradiation tolerant materials: Ti2ZrHfV0.5Mo0.2 high-entropy alloy
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 卷号: 35, 期号: 3, 页码: 369-373
作者:
Lu, Yiping
;
Huang, Hefei
;
Gao, Xuzhou
;
Ren, Cuilan
;
Gaob, Jie
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2021/02/02
High-entropy alloy
Irradiation resistance
Microstructural characterization
Defects evolution
A promising new class of irradiation tolerant materials: Ti2ZrHfV0.5Mo0.2 high-entropy alloy
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 卷号: 35, 期号: 3, 页码: 369-373
作者:
Lu, Yiping
;
Huang, Hefei
;
Gao, Xuzhou
;
Ren, Cuilan
;
Gaob, Jie
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2021/02/02
High-entropy alloy
Irradiation resistance
Microstructural characterization
Defects evolution
A promising new class of irradiation tolerant materials: Ti2ZrHfV0.5Mo0.2 high-entropy alloy
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 卷号: 35, 页码: 369-373
作者:
Lu, Yiping
;
Huang, Hefei
;
Gao, Xuzhou
;
Ren, Cuilan
;
Gaob, Jie
收藏
  |  
浏览/下载:21/0
  |  
提交时间:2019/12/02
High-entropy alloy
Irradiation resistance
Microstructural characterization
Defects evolution
A novel Zn-Cu-P master alloy and its modification performance on primary Si of A390 alloy
期刊论文
RESULTS IN PHYSICS, 2019, 卷号: 12, 页码: 1006-1010
作者:
Gao, Tong
;
Bian, Yihan
;
Liu, Xiangfa
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  |  
浏览/下载:3/0
  |  
提交时间:2019/12/11
Casting
Microstructural characterization
Al-Si alloy
Zinc-based
alloys
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