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Construction of low melting point alloy/graphene three-dimensional continuous thermal conductive pathway for improving in-plane and through-plane thermal conductivity of poly(vinylidene fluoride) composites 期刊论文
NANOTECHNOLOGY, 2020, 卷号: 31
作者:  Zhang, Ping;  Zhang, Xian;  Ding, Xin;  Wang, Yanyan;  Shu, Mengting
收藏  |  浏览/下载:50/0  |  提交时间:2020/11/30
Interface effects on the properties of Cu-Nb nanolayered composites 期刊论文
JOURNAL OF MATERIALS RESEARCH, 2020, 卷号: 35, 期号: 20, 页码: 2684-2700
作者:  An, Qi;  Yang, Wenfan;  Liu, Baoxi;  Zheng, Shijian
收藏  |  浏览/下载:153/0  |  提交时间:2021/02/02
Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites 期刊论文
MATERIALS & DESIGN, 2019, 卷号: 165, 页码: 8
作者:  Xue, Yang;  Li, Xiaofei;  Wang, Haosheng;  Zhao, Feng;  Zhang, Donghai
收藏  |  浏览/下载:60/0  |  提交时间:2019/04/03
Numerical prediction of thermal contact resistance of 3D C/C-SiC needled composites based on measured practical topography 期刊论文
International Journal of Heat and Mass Transfer, 2019, 卷号: 131, 页码: 176-188
作者:  Ren, Xing-Jie;  Dai, Yan-Jun;  Gou, Jian-Jun;  Tao, Wen-Quan
收藏  |  浏览/下载:10/0  |  提交时间:2019/11/19
Superior Thermal Interface Materials for Thermal Management 期刊论文
Composites Communications, 2019
作者:  Chang Ping Feng;  Lu Bai;  Rui-Ying Bao;  Shi-Wei Wang;  Zhengying Liu
收藏  |  浏览/下载:61/0  |  提交时间:2019/02/25
Characterisation of high thermal conductivity thin-film substrate systems and their interface thermal resistance 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2018, 卷号: 334, 页码: 233-242
作者:  Moridi, Alireza;  Zhang, Liangchi;  Liu, Weidong;  Duvall, Steven;  Brawley, Andrew
收藏  |  浏览/下载:3/0  |  提交时间:2019/11/26
Thermal-sprayed coating of optimally mixed ceramic powders on stainless steel with enhanced corrosion resistance 期刊论文
Journal of Iron and Steel Research International, 2018, 卷号: 25, 期号: 2, 页码: 207-212
作者:  Ping-hu Chen[1,2];  Zhi-lin Liu[1,2];  Rui-qing Li[2,3];  Chang-jun Qiu;  Xiao-qian Li[1,2,3]
收藏  |  浏览/下载:10/0  |  提交时间:2019/12/27
Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials 期刊论文
JOURNAL OF ELECTRONIC PACKAGING, 2017, 卷号: 139, 期号: 1, 页码: 1-8
作者:  Gao, Yunxia;  Wang, Xianping;  Liu, Jing;  Fang, Qianfeng
收藏  |  浏览/下载:31/0  |  提交时间:2018/07/04
Influence of the interface healing between the splashed particles and underlying bond coating on the cyclic oxidation behavior of LPPS MCrAlY bond coats 会议论文
作者:  Zhang, Bang-Yan;  Yang, Guan-Jun;  Li, Cheng-Xin;  Li, Chang-Jiu
收藏  |  浏览/下载:9/0  |  提交时间:2019/11/26
Reduction of Die-Bonding Interface Thermal Resistance for High-Power LEDs Through Embedding Packaging Structure 期刊论文
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2017, 卷号: 32, 期号: 7
作者:  Lei, Xiang;  Zheng, Huai;  Guo, Xing;  Zhang, Zefeng;  Wu, Jiading
收藏  |  浏览/下载:8/0  |  提交时间:2019/12/05


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