Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites | |
Xue, Yang1,2; Li, Xiaofei1,2; Wang, Haosheng2; Zhao, Feng1,2; Zhang, Donghai2; Chen, Yunfa2,3 | |
刊名 | MATERIALS & DESIGN |
2019-03-05 | |
卷号 | 165页码:8 |
关键词 | Vertically aligned-BN Through-plane thermal conductivity SR composites Interface thermal resistance Mechanical orientation |
ISSN号 | 0264-1275 |
DOI | 10.1016/j.matdes.2018.107580 |
英文摘要 | Effective heat dissipation has become a critical issue for electronic devices. In this study, the silicone rubber (SR)/vertically aligned boron nitride (BN) composites were prepared and the thermal conductivity of the composites was systematically investigated. The vertically aligned BNs constructed effective vertical thermal conductive pathways in the SR matrix, and the SR/ABN composites exhibited much higher through-plane thermal conductivity compared to the non-orientated SR/BN composite. The through-plane thermal conductivity of SR/ABN150 reached 5.4 W m(-1) K-1, which was similar to 6.3 and similar to 33 times higher than those of SR/BN150 and pure SR, respectively. In addition, the surface thermal infrared analysis also indicates that the vertically aligned SR/ABN composites possess excellent heat transfer capacity during the heating and cooling processes. The obtained results exhibit the potential for the design and preparation of thermal interface materials (TIMs) with high through-plane thermal conductivity to be applied in thermal conductive and electrical insulating field. (C) 2019 Elsevier Ltd. |
资助项目 | National Key R&D Program of China[2016YFC0204600] ; Strategic Priority Research Program of the Chinese Academy of Sciences[XDA09030202] |
WOS关键词 | POLYMER-BASED COMPOSITES ; NITRIDE NANOSHEETS ; COLD-PLASMA ; ENHANCEMENT ; BN ; NANOCOMPOSITES ; FABRICATION ; FILLERS ; FOAM |
WOS研究方向 | Materials Science |
语种 | 英语 |
出版者 | ELSEVIER SCI LTD |
WOS记录号 | WOS:000458259300010 |
资助机构 | National Key R&D Program of China ; Strategic Priority Research Program of the Chinese Academy of Sciences |
内容类型 | 期刊论文 |
源URL | [http://ir.ipe.ac.cn/handle/122111/27897] |
专题 | 中国科学院过程工程研究所 |
通讯作者 | Chen, Yunfa |
作者单位 | 1.Univ Chinese Acad Sci, Beijing 100049, Peoples R China 2.Chinese Acad Sci, Inst Proc Engn, China State Key Lab Multiphase Complex Syst, Beijing 100190, Peoples R China 3.Chinese Acad Sci, Inst Urban Environm, Ctr Excellence Reg Atmospher Environm, Xiamen 361021, Peoples R China |
推荐引用方式 GB/T 7714 | Xue, Yang,Li, Xiaofei,Wang, Haosheng,et al. Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites[J]. MATERIALS & DESIGN,2019,165:8. |
APA | Xue, Yang,Li, Xiaofei,Wang, Haosheng,Zhao, Feng,Zhang, Donghai,&Chen, Yunfa.(2019).Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites.MATERIALS & DESIGN,165,8. |
MLA | Xue, Yang,et al."Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites".MATERIALS & DESIGN 165(2019):8. |
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