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浏览/检索结果: 共3条，第1-3条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509 作者:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China. 收藏  |  浏览/下载：18/0  |  提交时间：2018/06/05 Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations   Phase transformation between Cu(In,Sn)(2) and Cu-2(In,Sn) compounds formed on single crystalline Cu substrate during solid state aging 期刊论文 Journal of Applied Physics, 2014, 卷号: 115, 期号: 4 F. F. Tian; Z. Q. Liu; J. D. Guo 收藏  |  浏览/下载：13/0  |  提交时间：2014/04/18 heterogeneous binary-systems  2 elementary substances  intermetallic  compounds  reaction-diffusion  growth  layers  interface  solders  joints  cu3sn   Building a portable file system for heterogeneous clusters 期刊论文 2010, 2010 Huang Qifeng; Yang Guangwen; Zheng Weimin; Shen Meiming; Deng Yiyan 收藏  |  浏览/下载：4/0