CORC

在结果中检索

CORC

浏览/检索结果: 共14条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
Enthalpic interaction promotes the stability of high elastic Cu-Ni-Sn alloys 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2022, 卷号: 896
作者:  Li, Z. M.;  Cheng, Z. L.;  Li, X. N.;  Hu, Y. L.;  Li, N. J.
收藏  |  浏览/下载：17/0  |  提交时间：2022/03/01
Compositional interpretation of high elasticity Cu–Ni–Sn alloys using cluster-plus-glue-atom model 期刊论文
Journal of Materials Research and Technology, 2022, 卷号: 17, 页码: 1246-1258
作者:  Yang, M.;  Hu, Y.L.;  Li, X.N.;  Li, Z.M.;  Zheng, Y.H.
收藏  |  浏览/下载：11/0  |  提交时间：2022/04/21
Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer 期刊论文
Ultrasonics Sonochemistry, 2018, 卷号: 45, 页码: 223-230
作者:  Xiao, Yong;  Wang, Qiwei;  Wang, Ling;  Zeng, Xian*;  Li, Mingyu
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/04
Effects of Nb addition on the microstructures and mechanical properties of a precipitation hardening Cu-9Ni-6Sn alloy 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2018, 卷号: 715, 页码: 340-347
作者:  Gao, Minqiang;  Chen, Zongning;  Kang, Huijun;  Li, Rengeng;  Wang, Wei
收藏  |  浏览/下载：100/0  |  提交时间：2019/12/02
Wetting of molten Sn-3.5Ag-O.5Cu on Ni-P(-SiC) coatings deposited on high volume faction SiC/Al composite 期刊论文
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2018, 卷号: 28, 页码: 1784-1792
作者:  Zhang, Xiang-zhao;  Wu, Xiao-lang;  Liu, Gui-wu;  Luo, Wen-qiang;  Guo, Ya-jie
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/26
Improving the Mechanical Properties of Cu-15Ni-8Sn Alloys by Addition of Titanium 期刊论文
MATERIALS, 2017, 卷号: 10
作者:  Zhao, Chao[1];  Zhang, Weiwen[1,2];  Wang, Zhi[1,2];  Li, Daoxi[1];  Luo, Zongqiang[1,2]
收藏  |  浏览/下载：102/0  |  提交时间：2019/04/24
Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating 期刊论文
Journal of Materials Science-Materials in Electronics, 2011, 卷号: 22, 期号: 9, 页码: 1234-1238
C. Chen; L. Zhang; Q. Q. Lai; C. F. Li; J. K. Shang
收藏  |  浏览/下载：10/0  |  提交时间：2012/04/13
Joint strength with soldering of Al/sub 2/O/sub 3/ ceramics after Ni-P chemical plating 期刊论文
2010, 2010
Zou Guisheng; Wu Aiping; Zhang Deku; Meng Fanming; Bai Hailin; Zhang Yongqing; Li Yi; Wu Shijie; Gu Zhaozhan
收藏  |  浏览/下载：4/0
Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates 期刊论文
Journal of Electronic Materials, 2008, 卷号: 37, 期号: 8, 页码: 1119-1129
H. F. Zou; Z. F. Zhang
收藏  |  浏览/下载：17/0  |  提交时间：2012/04/13
Microstructure of Ag-Sn-Cu-Bi-Ni alloy after oxidation 期刊论文
Transactions of Nonferrous Metals Society of China, 2007, 卷号: 17, 期号: A01, 页码: 551-555
作者:  Wu Chun-Ping*;  Yi Dan-Qing;  Li Jian;  Wang Bin;  Xu Can-Hui
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03

©版权所有 ©2017 CSpace - Powered by CSpace