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	Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者: Yu, Weiyuan; Li, Binbin; Wu, Baolei; Wang, Fengfeng; Wang, Mingkang 收藏 \| 浏览/下载：18/0 \| 提交时间：2022/08/09 Binary alloys Copper Copper alloys Indium alloys Lead-free solders Microstructure Shear flow Silicon carbide Soldering Temperature Thermoelectric equipment Wide band gap semiconductors Composite solders Electronics devices In-45cu composite solder paste Intermetallics compounds Microstructures and mechanical properties Service temperature Shears strength Solderpaste Ultrasonic action time Ultrasonic-assisted TLP
	Effective removal of heavy metal ions by attapulgite supported sulfidized nanoscale zerovalent iron from aqueous solution 期刊论文 Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2022, 卷号: 640 作者: Chen, Minzhang; Xu, Hui; Zhang, Yajuan; Zhao, Xuefang; Chen, Yong 收藏 \| 浏览/下载：18/0 \| 提交时间：2022/04/21 Activation energy Adsorption Chemicals removal (water treatment) Chromium compounds Copper compounds Heavy metals Iron compounds Metal ions Morphology Nanostructured materials Redox reactions Sulfur compounds Thermoanalysis Attapulgites Effective removals Heavy metal ion Nano scale Nano zero-valent irons Nano-scale zero valent irons Nanoscale zero-valent iron Removal of heavy metal ions Removal process Sulphur-modified
	Iodide-induced galvanic replacement of nickel film on copper as activator for electroless nickel-phosphorus plating 期刊论文 Materials Letters, 2022, 卷号: 314 作者: Zhao, Qiuping; Hu, Guanqun; Huang, Rui; Qiang, Li; Zhang, Xingkai 收藏 \| 浏览/下载：17/0 \| 提交时间：2022/04/21 Copper compounds Copper corrosion Corrosion resistance Corrosion resistant coatings Deposition Metal ions Metallic films Morphology Precious metals Copper ions Electrode potentials Electroless nickel-phosphorus plating Galvanic replacements Iodide Iodide solution Nickel film Replacement methods Replacement rates Thin-films
	Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating 期刊论文 Journal of Solid State Electrochemistry, 2022, 卷号: 26, 期号: 5, 页码: 1313-1322 作者: Hu, Guanqun; Huang, Rui; Wang, Hongli; Zhao, Qiuping; Zhang, Xingkai 收藏 \| 浏览/下载：36/0 \| 提交时间：2022/06/20 Chlorine compounds Corrosion resistance Electroless plating Eutectics Metallic films Morphology Nickel Nickel coatings Nickel compounds Nickel plating Palladium Phosphorus Solvents Surface morphology Surface treatment Activation ability Copper substrates Deep eutectic solvents Electroless Ni-P Electroless nickel-phosphorus plating Galvanic replacement deposition Galvanic replacements Nickel film Nickel phosphorus Palladium films
	New Findings of Pseudocapacitive Behaviors in Cupric Tungstate Dihydrate 期刊论文 Journal of Physical Chemistry C, 2022, 卷号: 126, 期号: 8, 页码: 3853-3863 作者: Gao, Jian-Fei; Hou, Jing-Feng; Kong, Ling-Bin 收藏 \| 浏览/下载：30/0 \| 提交时间：2022/04/21 Copper compounds Cyclic voltammetry Electric discharges Manganese oxide Niobium oxide Redox reactions Tungsten compounds Copper tungstate Cyclic voltammetry curves Dihydrates Electrochemicals Hot research topics Pseudo-capacitive materials Pseudocapacitance Pseudocapacitive Pseudocapacitive behavior Pseudocapacitors
	Effect of Ultrasonic Vibration Coupled with Direct Current on Wetting Behavior 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 卷号: 51, 期号: 3, 页码: 800-805 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Fengfeng; Wu, Baolei; Wang, Yanhong 收藏 \| 浏览/下载：21/0 \| 提交时间：2022/06/20 Copper Intermetallics Nanocomposites Precipitation (chemical) Ultrasonic applications Ultrasonic waves Wetting Cu substrate Direct current method Direct-current Driving forces Intermetallics compounds Liquid solders Power current Ultrasonic-vibration Wetting balance Wetting behavior
	A novel heterojunction ZnO/CuO piezoelectric catalysts: fabrication, optical properties and piezoelectric catalytic activity for efficient degradation of methylene blue 期刊论文 Journal of Materials Science: Materials in Electronics, 2022, 卷号: 33, 期号: 9, 页码: 7172-7190 作者: Wang, Shifa; Tang, Shengnan; Yang, Hua; Wang, Fei; Yu, Chuan 收藏 \| 浏览/下载：19/0 \| 提交时间：2022/04/21 Aromatic compounds Catalyst activity Copper Energy gap Heavy ions Heterojunctions II-VI semiconductors Methanol Molar ratio Morphology Optical properties Particle size Particle size analysis Phase structure Photoluminescence Piezoelectricity Surface morphology Zinc oxide Catalyst fabrication Characterization techniques Charge state Cu ions Methylene Blue Molar ratio Piezoelectric Polyacrylamide gel method Synthesised ]+ catalyst
	Study on preparation of glass-ceramics from multiple solid waste and coupling mechanism of heavy metals 期刊论文 Ceramics International, 2022 作者: Zou, Wanting; Zhang, Wenhua; Pi, Yilin; Zhang, Yunsheng; Chen, Yuan 收藏 \| 浏览/下载：18/0 \| 提交时间：2022/09/22 Copper compounds Fly ash Glass ceramics Iron Magnetite Municipal solid waste Sintering Waste incineration Waste treatment Zinc compounds Coupling mechanism Dominant factor Glass-ceramics Highest temperature Lead-zinc tailing Municipal solid wastes incineration fly ash Resources utilizations Temperature reconstruction Utilization rates Waste glass
	Strong elemental interaction enhances the thermal stability of coherent precipitation strengthened Cu–Ni–Al alloys 期刊论文 Materials Science and Engineering A, 2021, 卷号: 827 作者: Li, Z.M.; Li, X.N.; Yuan, J.H.; Hu, Y.L.; Zheng, Y.H. 收藏 \| 浏览/下载：8/0 \| 提交时间：2022/02/17 Aluminum alloys Binary alloys Calculations Copper alloys Dissolution Free energy Gibbs free energy Grain boundaries Nickel compounds Silicon alloys Thermodynamic stability Work function Coherent precipitation Cu content Discontinuous precipitation Grain-boundaries High-temperature properties Lattice misfits matrix NiAl alloy Re-dissolution Si addition
	Effect of Ultrasonic Vibration on Microstructure and Mechanical Properties of Welding-brazing Joint Between Aluminum and Copper by Plasma Welding 期刊论文 Cailiao Daobao/Materials Reports, 2021, 卷号: 35, 期号: 16, 页码: 16115-16119 作者: Fan, Ding; Li, Yongpeng; Wu, Lijian; Huang, Jiankang; Liu, Shien 收藏 \| 浏览/下载：30/0 \| 提交时间：2022/02/17 Aluminum Aluminum alloys Aluminum plating Binary alloys Copper alloys Eutectics Grain size and shape Intermetallics Plates (structural components) Shearing Tensile testing Ultrasonic waves Vibrations (mechanical) Welds Al-Cu eutectic Aluminium plates Brazing joints Grainsize Intermetallic compound layer Intermetallics compounds Microstructures and mechanical properties Red coppers Shearing strength Ultrasonic-vibration

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