CORC

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PREVENTING AGING OF ELECTRICALLY CONDUCTIVE ADHESIVES ON METAL SUBSTRATE USING GRAPHENE BASED BARRIER 会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:  Ye, Hui[1];  Huang, Shirong[2];  Yuan, Zhichao[3];  Lu, Xiuzhen[4];  Jeppson, Kjell[5]
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/26
2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5]
收藏  |  浏览/下载:11/0  |  提交时间:2019/04/26
Two-dimensional hexagonal boron nitride as lateral heat spreader in electrically insulating packaging 期刊论文
JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2016, 卷号: 49
作者:  Bao, Jie[1];  Edwards, Michael[2];  Huang, Shirong[3];  Zhang, Yong[4];  Fu, Yifeng[5]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/26
电动农用车横向电池包的散热性能 期刊论文
农业工程学报, 2016, 卷号: 32, 期号: z1, 页码: 13-19
作者:  Xu, Xiaoming[1];  Hu, Zhichao[2];  Yuan, Shouqi[3];  Xie, Huanxiong[4];  Zhang, Meng[5]
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/24
Genotypic variants at 2q33 and risk of esophageal squamous cell carcinoma in China: A meta-analysis of genome-wide association studies 期刊论文
Human Molecular Genetics, 2012, 卷号: 21, 期号: 9
作者:  Abnet, Christian C./6701628811[0];  Wang, Zhaoming/35346086300[1];  Song, Xin/13002663000[2];  Hu, Nan/7202092916[3];  Zhou, Fuyou/7401723562[4]
收藏  |  浏览/下载:43/0  |  提交时间:2019/12/04
Genotypic variants at 2q33 and risk of esophageal squamous cell carcinoma in China: A meta-analysis of genome-wide association studies 期刊论文
Human Molecular Genetics, 2012, 卷号: 21, 期号: 9
作者:  Abnet, Christian C./6701628811[0];  Wang, Zhaoming/35346086300[1];  Song, Xin/13002663000[2];  Hu, Nan/7202092916[3];  Zhou, Fuyou/7401723562[4]
收藏  |  浏览/下载:25/0  |  提交时间:2019/12/19
Influence of substrate on electrical conductivity of isotropic conductive adhesive 会议论文
2011 International Symposium on Advanced Packaging Materials, APM 2011, 2011-10-25
作者:  Hu, Zhili[1];  Du, Wenhui[2];  Yue, Cong[3];  Ye, Lilei[4];  Yuan, Zhichao[5]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/30
A Highly Conductive Bimodal Isotropic Conductive Adhesive and Its Reliability 会议论文
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13
作者:  Li, Dongsheng[1];  Cui, Huiwang[2];  Chen, Si[3];  Fan, Qiong[4];  Yuan, Zhichao[5]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/30
The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives 会议论文
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13
作者:  Fan, Qiong[1];  Cui, Huiwang[2];  Fu, Chune[3];  Li, Dongsheng[4];  Tang, Xin[5]
收藏  |  浏览/下载:4/0  |  提交时间:2019/04/30
Study on the Reliability of Fast Curing Isotropic Conductive Adhesive 会议论文
CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13
作者:  Du, Wenhui[1];  Cui, Huiwang[2];  Chen, Si[3];  Yuan, Zhichao[4];  Ye, Lilei[5]
收藏  |  浏览/下载:6/0  |  提交时间:2019/04/30


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