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科研机构
华南理工大学 [18]
内容类型
会议 [13]
会议论文 [5]
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浏览/检索结果:
共18条,第1-10条
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Process Development of Thick Si Interposer for 2.5D Integration of RF MEMS Devices (CPCI-S收录)
会议
作者:
Ren, Kuili
;
Ma, Shenglin[1]
;
Ma, Feilong
;
Yan, Jun
;
Xia, Yanming
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/04/11
Thick TSV interposer
high resistivity Si
CPW
Micro-strip
inductor
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package (CPCI-S收录)
会议
作者:
Luo, Rongfeng[1]
;
Ren, Kuili[1]
;
Ma, Shenglin[1]
;
Yan, Jun[1]
;
Xia, Yanming[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
Air-gapped Si
Si interposer
low stress
hermetical
System-in-Package
MEMS
Process Development of Through-Glass-Via (TGV) Interposer for Radio Frequency (RF) Applications (CPCI-S收录)
会议
作者:
Yan, Jun
;
Ma, Shenglin[1]
;
Ma, Feilong
;
Xia, Yanming
;
Luo, Rongfeng
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
TGVinterposer
RF
Electrical property
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple (CPCI-S收录)
会议
作者:
Guan, Yong[1]
;
Zeng, Qinghua[1]
;
Bian, Yuan[1]
;
Zhong, Xiao[1]
;
Chen, Jing[1]
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/04/11
3D packaging
fine pitch TSV
micro heater
thermocouple
quality evaluation
Process Development of a New TGV Interposer for Wafer Level Package of Inertial MEMS Device (CPCI-S收录)
会议
作者:
Ma, Shenglin[1]
;
Ren, Kuili[1]
;
Xia, Yanming[1]
;
Yan, Jun[1]
;
Luo, Rongfeng[1]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
TGV interposer
Al RDL
Wafer level packaging
Inertial devices
Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening (CPCI-S收录)
会议
作者:
Guan, Yong[1]
;
Zeng, Qinghua[1]
;
Chen, Jing[1]
;
Ma, Shenglin[2]
;
Jin, Yufeng[3]
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/04/11
TSV
3D packaging
sidewall insulation
electrical properties
CMP
Interposer Fabrication with Annular Copper TSV and Multi-layered Redistribution Layer (CPCI-S收录)
会议
作者:
Guan, Yong[1]
;
Ma, Shenglin[2]
;
Zeng, Qinghua[1]
;
Meng, Wei[1,3]
;
Chen, Jing[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
Fabrication and Filling Quality Optimization of the High Density and Small Size Through Silicon Via Array for Three-dimensional Packaging (CPCI-S收录)
会议
作者:
Guan, Yong[1]
;
Zeng, Qinghua[1]
;
Chen, Jing[1]
;
Ma, Shenglin[2]
;
Meng, Wei[3]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
through silicon via
packaging
electroplating
additives
Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer (CPCI-S收录)
会议
作者:
Xia, Yanming[1]
;
Ren, Kuili[1]
;
Ma, Shenglin[1]
;
Guan, Yong[2]
;
Cai, Han[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
petaloid hollow Cu interconnection
3D TSV interposer
thermal-mechanical simulation
influence on electrical property
Parametric Study of DRIE Process for Enhancing the Profile-preserving Property of Square Through Silicon Via (CPCI-S收录)
会议
作者:
Guan, Yong[1]
;
Zeng, Qinghua[1]
;
Chen, Jing[1]
;
Ma, Shenglin[2]
;
Meng, Wei[3]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
through silicon via
3D packaging
DRJE
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