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CORC

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Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 744, 页码: 406-414
作者:  Long, Xu[1];  Li, Zhen[2];  Lu, Xiuzhen[3];  Guo, Hongcun[4];  Chang, Chao[5]
收藏  |  浏览/下载：48/0  |  提交时间：2019/04/22
Finite Element Analysis to the Constitutive Behavior of Sintered Silver Nanoparticles Under Nanoindentation 期刊论文
INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2018, 卷号: 10
作者:  Long, Xu[1];  Du, Chongyang[2];  Li, Zhen[3];  Guo, Hongcun[4];  Yao, Yao[5]
收藏  |  浏览/下载：19/0  |  提交时间：2019/04/22
MDS Investigation on the Melting and Solidification of Silver Nanoparticles 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhang, Yan[1];  Zhang, Guoqiang[2];  Lu, Xiuzhen[3];  Zhang, Qiaoran[4];  Liu, Johan[5]
收藏  |  浏览/下载：6/0  |  提交时间：2019/04/22
The influence of sintering process on thermal properties of nano-silver paste 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Lu, Xiuzhen[1];  Zhang, Qianran[2];  Zehri, Abdelhafid[3];  Ke, Wei[4];  Huang, Shirong[5]
收藏  |  浏览/下载：15/0  |  提交时间：2019/04/22
An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5]
收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24
Effect of sintering method on properties of nanosilver paste 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Zhang, Qiaoran[1];  Liu, Jiawen[2];  Ke, Wei[3];  Huang, Shirong[4];  Latorre, Marti Gutierrez[5]
收藏  |  浏览/下载：16/0  |  提交时间：2019/04/24
Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/24
Mfsd2a(+) hepatocytes repopulate the liver during injury and regeneration 期刊论文
2016, 卷号: 7, 期号: [db:dc_citation_issue]
作者:  Pu, Wenjuan[1,2];  Zhang, Hui[1,2];  Huang, Xiuzhen[1,2];  Tian, Xueying[1,2];  He, Lingjuan[1,2]
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03
PREVENTING AGING OF ELECTRICALLY CONDUCTIVE ADHESIVES ON METAL SUBSTRATE USING GRAPHENE BASED BARRIER 会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:  Ye, Hui[1];  Huang, Shirong[2];  Yuan, Zhichao[3];  Lu, Xiuzhen[4];  Jeppson, Kjell[5]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26

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