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科研机构
合肥物质科学研究院 [4]
西安交通大学 [1]
内容类型
期刊论文 [4]
会议论文 [1]
发表日期
2019 [1]
2018 [3]
2017 [1]
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Preparation and characterization of epoxy-based composite with multilayered structure and high thermal conductivity
期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6
作者:
Chen, Lu
;
Xiao, Chao
;
Tang, Yunlu
;
Zhang, Xian
;
Zheng, Kang
收藏
  |  
浏览/下载:36/0
  |  
提交时间:2020/11/26
epoxy
h-BN
multilayered structure
thermally conductive path
thermal conductivity
Fabrication of Thermal Conductivity Enhanced Polymer Composites by Constructing an Oriented Three-Dimensional Staggered Interconnected Network of Boron Nitride Platelets and Carbon Nanotubes
期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2018, 卷号: 10, 期号: 42, 页码: 36342-36351
作者:
Su, Zheng
;
Wang, Hua
;
He, Jing
;
Guo, Yulan
;
Qu, Qiqi
收藏
  |  
浏览/下载:33/0
  |  
提交时间:2019/12/25
polymer-matrix composites
thermal conductivity
hexagonal boron nitride
carbon nanotube
Synergistic enhancement of anisotropic thermal transport flexible polymer composites filled with multi-layer graphene (mG) and mussel-inspiring modified hexagonal boron nitride (h-BN)
期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2018, 卷号: 111, 页码: 12-22
作者:
Su, Zheng
;
Wang, Hua
;
Ye, Xianzhu
;
Tian, Konghu
;
Huang, Weiqi
收藏
  |  
浏览/下载:34/0
  |  
提交时间:2019/11/11
Polymer-matrix composites (PMCs)
Graphene
Thermal properties
Anisotropy
Anisotropic thermally conductive flexible polymer composites filled with hexagonal born nitride (h-BN) platelets and ammine carbon nanotubes (CNT-NH2): Effects of the filler distribution and orientation
期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2018, 卷号: 109, 期号: 无, 页码: 402-412
作者:
Su, Zheng
;
Wang, Hua
;
Ye, Xianzhu
;
Tian, Konghu
;
Huang, Weiqi
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  |  
浏览/下载:35/0
  |  
提交时间:2019/08/23
Polymer-matrix composites (PMCs)
3-Dimensional reinforcement
Thermal properties
Anisotropy
Epoxy/h-BN Composites Based on Oriented. Boron Nitride Platelets With High Thermally Conductivity for Electronic Encapsulation
会议论文
作者:
Wang, Zhengdong
;
Huang, Jialiang
;
Chen, Siyu
;
Yang, Mengmeng
;
Liu, Jingya
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  |  
浏览/下载:6/0
  |  
提交时间:2019/11/26
Electronic Encapsulation
thermal conductivity
hexagonal boron nitride platelets
alignment
epoxy composite
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