| Epoxy/h-BN Composites Based on Oriented. Boron Nitride Platelets With High Thermally Conductivity for Electronic Encapsulation | |
| Wang, Zhengdong; Huang, Jialiang; Chen, Siyu; Yang, Mengmeng; Liu, Jingya; Xie, Qian; Cheng, Yonghong | |
| 2017 | |
| 关键词 | Electronic Encapsulation thermal conductivity hexagonal boron nitride platelets alignment epoxy composite |
| 会议录 | 2017 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP)
 |
| URL标识 | 查看原文 |
| ISSN号 | 9781509042784 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2945874 |
| 专题 | 西安交通大学 |
| 推荐引用方式 GB/T 7714 | Wang, Zhengdong,Huang, Jialiang,Chen, Siyu,et al. Epoxy/h-BN Composites Based on Oriented. Boron Nitride Platelets With High Thermally Conductivity for Electronic Encapsulation[C]. 见:. |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论