CORC

在结果中检索

CORC

浏览/检索结果: 共20条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
Effects of aluminum addition (x=0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 8
作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin
收藏  |  浏览/下载：11/0  |  提交时间：2019/11/15
Effects of aluminum addition (x = 0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文
Materials Research Express, 2019, 卷号: 6, 期号: 8
作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14
Influence of crystalline structure on diffusion barrier property of electroless Ni-Fe-P coatings in Zn-Al solder interconnects 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 804
作者:  Liu, Li;  Zhang, Han;  Zheng, Hao;  Peng, Juan;  Gong, Pan
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05
Microstructure of Ultrasonic-assisted Soldering Mg/Al Dissimilar Metal Joints 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 10, 页码: 3197-3202
作者:  Yu Weiyuan;  Gao Mengzhao;  Zhang Tianyu;  Shang Jiangxu;  Yan Zehua
收藏  |  浏览/下载：0/0  |  提交时间：2019/11/15
Microstructure of Ultrasonic-assisted Soldering Mg/Al Dissimilar Metal Joints 期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2018, 卷号: 47, 期号: 10, 页码: 3197-3202
作者:  Yu, Weiyuan;  Gao, Mengzhao;  Zhang, Tianyu;  Shang, Jiangxu;  Yan, Zehua
收藏  |  浏览/下载：3/0  |  提交时间：2022/02/17
Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy 会议论文
7th Electronic System-Integration Technology Conference (ESTC), Dresden, GERMANY, SEP 18-21, 2018
作者:  Zhou, Zhaoxia*;  Liu, Li;  Liu, Changqing
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/04
Diffusion barrier properties of electroless Ni-Fe-P coatings in Zn-5Al solder joints 会议论文
作者:  Zhang, Han;  Chen, Zhiwen;  Pengv, Juan;  Liu, Li
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/05
Diffusion barrier properties of electroless Ni-Fe-P coatings in Zn-5Al solder joints 其他
2018-01-01
作者:  Zhang, Han;  Chen, Zhiwen;  Peng, Juan;  Liu, Li
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/05
Diffusion barrier properties of electroless Ni-Fe-P coatings in Zn-5Al solder joints 其他
2018-01-01
作者:  Zhang, Han;  Chen, Zhiwen;  Peng, Juan;  Liu, Li
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/05
Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects 期刊论文
Journal of Alloys and Compounds, 2017, 卷号: 722, 页码: 746-752
作者:  Liu, Li;  Chen, Zhiwen*;  Zhou, Zhaoxia;  Chen, Guang;  Wu, Fengshun
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/04

©版权所有 ©2017 CSpace - Powered by CSpace