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CORC

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Imaging ultrafast evolution of subwavelength-sized topography using single-probe structured light microscopy 期刊论文
Photonics Research, 2022, 卷号: 10, 期号: 8, 页码: 1900-1908
作者:  J. Xu;  C. J. Min;  Y. Q. Zhang;  J. L. Ni;  G. W. Cao
收藏  |  浏览/下载：4/0  |  提交时间：2023/06/14
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ;  Wang BY;  Chen L;  Chen L
收藏  |  浏览/下载：53/0  |  提交时间：2019/11/27
Artificial intelligent matching for scratches of semiconductor wafers based on a K-NN algorithm 期刊论文
SURFACE TOPOGRAPHY-METROLOGY AND PROPERTIES, 2019, 卷号: 7
作者:  Pan, Tingting;  Yang, Jie;  Wu, Wei;  Dung, Zhigang;  Ayinde, Babajide O.
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Silicon content design of CrSiN films for good anti-corrosion and anti-wear performances in NaOH solution 期刊论文
Surface Topography: Metrology and Properties, 2018, 卷号: 6, 期号: 2, 页码: 024001(1-10)
作者:  Wang, Haixin;  Ye, Yuwei;  Wang, Chunting;  Zhang GA(张广安);  Liu, Wei
收藏  |  浏览/下载：26/0  |  提交时间：2018/06/05
Mitigating the influence of wafer topography on the implantation process in optical lithography 期刊论文
Optics Letter, 2017
作者:  Su XJ(苏晓菁);  Dong LS(董立松);  Chen WH(陈文辉);  Fan TA(范泰安);  Wei YY(韦亚一)
收藏  |  浏览/下载：18/0  |  提交时间：2018/06/08
Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond diamond plates 期刊论文
MATERIALS AND MANUFACTURING PROCESSES, 2017, 卷号: 32, 页码: 121-126
作者:  Gao, Shang;  Kang, Ren-Ke;  Dong, Zhi-Gang;  Zhang, Bi;  Wang, Zi-Guang
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Glass-SOI-Based Hybrid-Bonded Capacitive Micromachined Ultrasonic Transducer With Hermetic Cavities for Immersion Applications 期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2016, 卷号: 25, 期号: 5
作者:  Miao, Jing;  Wang, Hui;  Li, Peng;  Shen, Wenjiang(沈文江);  Xue, Chenyang
收藏  |  浏览/下载：30/0  |  提交时间：2017/03/11
Effects of Polishing Parameters on Evolution of Different Wafer Patterns During Cu CMP 期刊论文
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2015, 卷号: 28, 期号: 1, 页码: 106-116
作者:  Wu, Lixiao;  Yan, Changfeng
收藏  |  浏览/下载：8/0  |  提交时间：2019/11/15
Effects of polishing parameters on evolution of different wafer patterns during Cu CMP 期刊论文
IEEE Transactions on Semiconductor Manufacturing, 2015, 卷号: 28, 期号: 1, 页码: 106-116
作者:  Wu, Lixiao;  Yan, Changfeng
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14

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