| Artificial intelligent matching for scratches of semiconductor wafers based on a K-NN algorithm | |
| Pan, Tingting; Yang, Jie; Wu, Wei; Dung, Zhigang; Ayinde, Babajide O. | |
| 刊名 | SURFACE TOPOGRAPHY-METROLOGY AND PROPERTIES
 |
| 2019 | |
| 卷号 | 7 |
| 关键词 | semiconductor wafer K-NN algorithm scratches matching |
| ISSN号 | 2051-672X |
| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3217524 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Sch Math Sci, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Sch Math Sci, Dalian 116024, Peoples R China. 3.Univ Louisville, Elect & Comp Engn, Louisville, KY 40292 USA. 4.Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining, Dalian 116024, Peoples R China. 5.Univ Louisville, Elect & Comp Engn, Louisville, KY 40292 USA. |
| 推荐引用方式 GB/T 7714 | Pan, Tingting,Yang, Jie,Wu, Wei,et al. Artificial intelligent matching for scratches of semiconductor wafers based on a K-NN algorithm[J]. SURFACE TOPOGRAPHY-METROLOGY AND PROPERTIES,2019,7. |
| APA | Pan, Tingting,Yang, Jie,Wu, Wei,Dung, Zhigang,&Ayinde, Babajide O..(2019).Artificial intelligent matching for scratches of semiconductor wafers based on a K-NN algorithm.SURFACE TOPOGRAPHY-METROLOGY AND PROPERTIES,7. |
| MLA | Pan, Tingting,et al."Artificial intelligent matching for scratches of semiconductor wafers based on a K-NN algorithm".SURFACE TOPOGRAPHY-METROLOGY AND PROPERTIES 7(2019). |
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