CORC

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CORC

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Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2022/07/01
The open-pin failure of power device under the combined effect of thermo-migration and electro-migration 期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
作者:  Gao Liyin;  Li Caifu;  Cao Lihua;  Liu Zhiquan
收藏  |  浏览/下载：15/0  |  提交时间：2021/02/03
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2018, 卷号: 216, 页码: 130-135
作者:  Zhong, Y.;  Zhao, N.;  Dong, W.;  Wang, Y. P.;  Ma, H. T.
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02
Formation mechanism of a cathodic serrated interface and voids under high current density 期刊论文
MATERIALS LETTERS, 2018, 卷号: 211, 页码: 191-194
作者:  Zhang, Z. H.[1,2];  Cao, H. J.[3];  Chen, H. T.[4]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/22
Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Under Thermomigration 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 页码: 1931-1936
作者:  Zhao, N.;  Deng, J. F.;  Zhong, Y.;  Huang, M. L.;  Ma, H. T.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 695, 页码: 1436-1443
作者:  Zhong, Y.;  Zhao, N.;  Ma, H. T.;  Dong, W.;  Huang, M. L.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding 期刊论文
JOURNAL OF MATERIALS RESEARCH, 2017, 卷号: 32, 页码: 3128-3136
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Ma, Haitao;  Huang, Mingliang
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/03
Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding 期刊论文
JOURNAL OF MATERIALS RESEARCH, 2017, 卷号: 32, 页码: 3128-3136
作者:  Zhong, Yi[1];  Zhao, Ning[2];  Dong, Wei[3];  Ma, Haitao[4];  Huang, Mingliang[5]
收藏  |  浏览/下载：7/0  |  提交时间：2019/04/24
Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applications by imposing temperature gradient 会议论文
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017-01-01
作者:  Zhong, Y.;  Zhao, N.;  Ma, H. T.;  Dong, W.;  Huang, M. L.
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09

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