Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding | |
Zhong, Yi; Zhao, Ning; Dong, Wei; Ma, Haitao; Huang, Mingliang; Yin, Luqiao; Wong, Chingping | |
刊名 | JOURNAL OF MATERIALS RESEARCH
![]() |
2017 | |
卷号 | 32页码:3128-3136 |
ISSN号 | 0884-2914 |
URL标识 | 查看原文 |
WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3313692 |
专题 | 大连理工大学 |
作者单位 | 1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.Shanghai Univ, Minist Educ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China. 3.Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA. |
推荐引用方式 GB/T 7714 | Zhong, Yi,Zhao, Ning,Dong, Wei,et al. Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding[J]. JOURNAL OF MATERIALS RESEARCH,2017,32:3128-3136. |
APA | Zhong, Yi.,Zhao, Ning.,Dong, Wei.,Ma, Haitao.,Huang, Mingliang.,...&Wong, Chingping.(2017).Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding.JOURNAL OF MATERIALS RESEARCH,32,3128-3136. |
MLA | Zhong, Yi,et al."Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding".JOURNAL OF MATERIALS RESEARCH 32(2017):3128-3136. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论