CORC

在结果中检索

CORC

浏览/检索结果: 共35条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
Study of Annular Copper-Filled TSVs of Sensor and Interposer Chips for 3-D Integration 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 卷号: 9, 期号: 3
作者:  Li, Cao;  Zou, Jinglong;  Liu, Sheng;  Zheng, Huai;  Fei, Peng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/05
Compact optical transceiver by hybrid multichip integration 专利
专利号: US9921379, 申请日期: 2018-03-20, 公开日期: 2018-03-20
作者:  DING, LIANG;  NAGARAJAN, RADHAKRISHNAN L.;  COCCIOLI, ROBERTO
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/23
Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of a 3-D-TSV Stack by Simulation 期刊论文
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2017
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
内嵌扰流式微通道TSV转接板关键工艺及其特性研究 学位论文
2016, 2016
夏雁鸣
收藏  |  浏览/下载：5/0  |  提交时间：2017/06/20
Formation of Polymer Insulation Layer (Liner) on Through Silicon Vias (TSV) with High Aspect Ratio over 5:1 by Direct Spin Coating 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Li, Liyi;  Tuan, Chia-Chi;  Moon, Kyoung-Sik;  Zhang, Guoping;  Sun, Rong
收藏  |  浏览/下载：37/0  |  提交时间：2017/01/15
Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 其他
2016-01-01
Luo, Rongfeng; Ren, Kuili; Ma, Shenglin; Yan, Jun; Xia, Yanming; Jin, Yufeng; Chen, Jing; Wu, Tianzhun; Yang, Hangao; Yuan, Lifang
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer 其他
2016-01-01
Xia, Yanming; Ren, Kuili; Ma, Shenglin; Guan, Yong; Cai, Han; Luo, Rongfeng; Yan, Jun; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Fabrication Process of a TSV Interposer for Radio Frequency Chip with Integrated Passive Devices 其他
2016-01-01
Meng, Wei; Jin, Yufeng; Guan, Yong; Zeng, Qinghua; Hen, Jing C.
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Process Development of Thick Si Interposer for 2.5D Integration of RF MEMS Devices 其他
2016-01-01
Ren, Kuili; Ma, Shenglin; Ma, Feilong; Yan, Jun; Xia, Yanming; Luo, Rongfeng; Jin, Yufeng; Chen, Jing
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03

©版权所有 ©2017 CSpace - Powered by CSpace