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Enhanced mechanical properties and corrosion behavior of Zn-30Sn-2Cu high-temperature lead-free solder alloy by adding Sm 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 9, 页码: 6469-6484
作者:  Zhang, Huajin;  Hu, Xiaowu;  Liu, Yi;  Zhang, Jiankang;  Jiang, Xiongxin
收藏  |  浏览/下载：28/0  |  提交时间：2022/03/01
Effects of aluminum addition (x=0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 8
作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin
收藏  |  浏览/下载：11/0  |  提交时间：2019/11/15
Effects of aluminum addition (x = 0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文
Materials Research Express, 2019, 卷号: 6, 期号: 8
作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14
Microstructure of Ultrasonic-assisted Soldering Mg/Al Dissimilar Metal Joints 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 10, 页码: 3197-3202
作者:  Yu Weiyuan;  Gao Mengzhao;  Zhang Tianyu;  Shang Jiangxu;  Yan Zehua
收藏  |  浏览/下载：0/0  |  提交时间：2019/11/15
Microstructure of Ultrasonic-assisted Soldering Mg/Al Dissimilar Metal Joints 期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2018, 卷号: 47, 期号: 10, 页码: 3197-3202
作者:  Yu, Weiyuan;  Gao, Mengzhao;  Zhang, Tianyu;  Shang, Jiangxu;  Yan, Zehua
收藏  |  浏览/下载：3/0  |  提交时间：2022/02/17
Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Aging 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/02
In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2018, 卷号: 216, 页码: 130-135
作者:  Zhong, Y.;  Zhao, N.;  Dong, W.;  Wang, Y. P.;  Ma, H. T.
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02
Effect of Zn content on Cu-Ni cross-interaction in Cu/Sn-xZn/Ni micro solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 页码: 5064-5073
作者:  Zhao, N.;  Wang, M. Y.;  Zhong, Y.;  Ma, H. T.;  Wang, Y. P.
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Influence of RE and Ni on Microstructure and Properties of Zn20Sn High -temperature Lead-Free Solder 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 页码: 1860-1865
作者:  Li Xiaojun;  Tian Jun;  Dai Pinqiang;  Wang Haiyan
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/21
快速凝固对Sn-8Zn-3Bi合金特性及高温时效钎料/铜焊点结构演变的影响 Influence of rapid solidification on Sn-8Zn-3Bi alloy characteristics and microstructural evolution of solder/Cu joints during elevated temperature aging 期刊论文
2017, 卷号: 27, 页码: 234-240
作者:  赵国际[1];  文光华[1];  盛光敏[1]
收藏  |  浏览/下载：7/0  |  提交时间：2019/11/28

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