CORC

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CORC

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Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20
作者:  Zhang, Sinan;  Wang Z(王臻);  Wang, Jie;  Duan GH(段桂花);  Li, Haixia
收藏  |  浏览/下载：21/0  |  提交时间：2022/08/22
Temperature and NaCl deposition dependent corrosion of SAC305 solder alloy in simulated marine atmosphere 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2021, 卷号: 75, 页码: 252-264
作者:  Qiao, Chuang;  Wang, Mingna;  Hao, Long;  Liu, Xiahe;  Jiang, Xiaolin
收藏  |  浏览/下载：17/0  |  提交时间：2021/10/15
In-situ EIS study on the initial corrosion evolution behavior of SAC305 solder alloy covered with NaCl solution 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 卷号: 852, 页码: 12
作者:  Qiao, Chuang;  Wang, Mingna;  Hao, Long;  Jiang, Xiaolin;  Liu, Xiahe
收藏  |  浏览/下载：59/0  |  提交时间：2021/02/02
In-situ EIS study on the initial corrosion evolution behavior of SAC305 solder alloy covered with NaCl solution 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 卷号: 852, 页码: 12
作者:  Qiao, Chuang;  Wang, Mingna;  Hao, Long;  Jiang, Xiaolin;  Liu, Xiahe
收藏  |  浏览/下载：58/0  |  提交时间：2021/02/02
Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：16/0  |  提交时间：2020/11/14
Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 51, 页码: 40-53
作者:  Wang, Mingna;  Qiao, Chuang;  Jiang, Xiaolin;  Hao, Long;  Liu, Xiahe
收藏  |  浏览/下载：13/0  |  提交时间：2021/02/02
Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 51, 页码: 40-53
作者:  Wang, Mingna;  Qiao, Chuang;  Jiang, Xiaolin;  Hao, Long;  Liu, Xiahe
收藏  |  浏览/下载：19/0  |  提交时间：2021/02/02
Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文
Journal of Alloys and Compounds, 2020, 卷号: 832
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：21/0  |  提交时间：2020/11/14
Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330
作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Zhou, Liuru;  Li, Qinglin
收藏  |  浏览/下载：11/0  |  提交时间：2020/06/16
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02

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