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Recyclable Printed Circuit Boards and Alkali Reduction Wastewater: Approach to a Sustainable Copper-Based Metal-Organic Framework
期刊论文
ACS SUSTAINABLE CHEMISTRY & ENGINEERING, 2020, 卷号: 8, 期号: 3, 页码: 1371-1379
作者:
Zhang, Shaopeng
;
Jian, Meipeng
;
Zhang, Qi
;
Xu, Rongming
;
Qu, Jiuhui
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2021/09/15
Waste recovery
Wastewater
Metal-organic framework
Sustainability
The Far-field Estimation for Microstrip Line Based on Near-field Scanning
会议论文
2018 12th International Symposium on Antennas, Propagation and EM Theory, ISAPE 2018 - Proceedings, 2018-12-03
作者:
Liu, W.
;
Yan, Z.
;
Min, Z.
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2019/12/30
Electromagnetic compatibility
Field emission
Microstrip lines
Scanning
Emission estimation
Equivalent source
Far field
Full-wave simulations
Near-field scanning
Printed circuit boards (PCB)
Radiation source
Tangential components
Printed circuit boards
Effects of Particle Size and Heating Rate on Evolution of Products from Pyrolysis of Phenolic Circuit Boards
期刊论文
ENVIRONMENTAL ENGINEERING SCIENCE, 2018, 卷号: 35, 期号: 2, 页码: 95-100
作者:
Zhang, Shangzhong
;
Yu, Yang
;
Wu, Caibin
;
Shi, Guiming
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/11/15
heating rate
micro-explosion
printed circuit board
pyrolysis
resource recycling and recovery
Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure
期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 1, 页码: 175, 187
作者:
Zhang, Hui
;
Li, Jianfeng
;
Dai, Jingru
;
Corfield, Martin
;
Liu, Xuejian
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  |  
浏览/下载:31/0
  |  
提交时间:2018/12/28
Electronic packaging
finite-element (FE) method
material reliability
planar power module
power cycling
X-ray computation tomography
Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 11, 页码: 8877-8885
作者:
Li, Xiaogang
;
Xiong, Ruilin
;
Hu, Yuting
;
Wu, Junsheng
;
Dong, Chaofang
收藏
  |  
浏览/下载:130/0
  |  
提交时间:2018/12/04
Electrochemical Migration
Raman-spectroscopy
Pcb-imag
Copper
Contamination
Temperature
Reliability
Mechanism
Evolution
Alloys
Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 11, 页码: 8877-8885
作者:
Li, Xiaogang
;
Xiong, Ruilin
;
Hu, Yuting
;
Wu, Junsheng
;
Dong, Chaofang
收藏
  |  
浏览/下载:133/0
  |  
提交时间:2018/12/04
Electrochemical Migration
Raman-spectroscopy
Pcb-imag
Copper
Contamination
Temperature
Reliability
Mechanism
Evolution
Alloys
Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference
期刊论文
CHEMICAL ENGINEERING JOURNAL, 2018, 卷号: 336, 页码: 92-101
作者:
Xiao, Kui
;
Gao, Xiong
;
Yan, Lidan
;
Yi, Pan
;
Zhang, Dawei
收藏
  |  
浏览/下载:62/0
  |  
提交时间:2018/12/04
Thin Electrolyte Layer
Raman-spectroscopy
Relative-humidity
Ion concentratIon
Chloride Media
Copper
Behavior
Alloys
Silver
H2s
A novel recovery method of copper from waste printed circuit boards by supercritical methanol process: Preparation of ultrafine copper materials
期刊论文
WASTE MANAGEMENT, 2017, 卷号: 60, 期号: 0, 页码: 643-651
作者:
Chen, Mengjun
;
Zhang, Zhigang
;
Yu, Gending
;
Qi, Yingying
;
Weng, Huiwei
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2018/07/25
Waste Pcb
Ultrafine Copper Materials
Supercritical Methanol
Swarm-based intelligent optimization approach for layout problem.
期刊论文
MULTIMEDIA TOOLS AND APPLICATIONS, 2017
作者:
Zhao, Fengqiang
;
Li, Guangqiang
;
Zhang, Rubo
;
Du, Jialu
;
Guo, Chen
收藏
  |  
浏览/下载:20/0
  |  
提交时间:2018/02/02
Surface failure mechanism of PCB-ENIG in typical outdoor atmospheric environments
期刊论文
MATERIALS RESEARCH BULLETIN, 2017, 卷号: 91, 页码: 179-188
作者:
Yi, Pan
;
Xiao, Kui
;
Ding, Kangkang
;
Dong, Chaofang
;
Li, Xiaogang
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2017/12/25
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