Surface failure mechanism of PCB-ENIG in typical outdoor atmospheric environments

CORC > 宁波材料技术与工程研究所 > 中国科学院宁波材料技术与工程研究所 > 2017专题

	Surface failure mechanism of PCB-ENIG in typical outdoor atmospheric environments
	Yi, Pan; Xiao, Kui; Ding, Kangkang; Dong, Chaofang; Li, Xiaogang
刊名	MATERIALS RESEARCH BULLETIN
	2017
卷号	91 页码:179-188
ISSN号	0025-5408
英文摘要	Electroless nickel/immersion gold (ENIG)-plated printed circuit boards (PCBs) were exposed to typical atmospheric environments in China for prolonged periods to understand the mechanism of corrosion failure. Results showed that the corrosion products that covered PCB-ENIG played a protective role by filling, covering, and coating surface defects. Under Turpan atmospheric environment, the plating layer was prone to damage easily, resulting in loss of protective properties. The corrosion mechanism was mainly microporous corrosion, in which halo-shaped macropores with a raised nucleus in the center were formed. When electrical bias was applied, PCB-ENIG was prone to electrochemical migration (ECM) caused by galvanic effects in the form of localized corrosion. Both Ni and Cu elements were involved in the ECM process. The synergistic effect of contaminated medium and high humidity is the critical factor of the ECM-induced PCB-ENIG corrosion. (C) 2017 Elsevier Ltd. All rights reserved.
公开日期	2017-12-25
内容类型	期刊论文
源URL	[http://ir.nimte.ac.cn/handle/174433/13760]
专题	2017专题
推荐引用方式 GB/T 7714	Yi, Pan,Xiao, Kui,Ding, Kangkang,et al. Surface failure mechanism of PCB-ENIG in typical outdoor atmospheric environments[J]. MATERIALS RESEARCH BULLETIN,2017,91:179-188.
APA	Yi, Pan,Xiao, Kui,Ding, Kangkang,Dong, Chaofang,&Li, Xiaogang.(2017).Surface failure mechanism of PCB-ENIG in typical outdoor atmospheric environments.MATERIALS RESEARCH BULLETIN,91,179-188.
MLA	Yi, Pan,et al."Surface failure mechanism of PCB-ENIG in typical outdoor atmospheric environments".MATERIALS RESEARCH BULLETIN 91(2017):179-188.