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浏览/检索结果: 共4条，第1-4条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文 Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 作者:  Wang, Z.;  Fan, J.;  Liu, J.;  Hu, A.;  Qian, C. 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/30 Chip scale packages  Light emission  Light emitting diodes  Phosphors  Silicones  Ultraviolet radiation  Viscosity  Cure process  Harsh environment  High temperature cure  Light emitting diode (LED)  Low-power consumption  Ultra-violet light  Ultraviolet light intensity  Ultraviolet-assisted  Curing   Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Wang, Zhen;  Fan, Jiajie;  Liu, Jie;  Hu, Aihua;  Qian, Cheng 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30 LED  Chip scale package  Phosphor/silicone composites  Viscosity  Optimal cure process   Phosphor settling induced mechanical degradation of silicone/phosphor composite in light emitting diode packages 期刊论文 JOURNAL OF APPLIED POLYMER SCIENCE, 2015, 卷号: 132, 期号: 22 作者:  Chen, Xing;  Wang, Simin;  Chen, Mingxiang;  Liu, Sheng 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/05 composites  degradation  mechanical properties  microscopy  structure  property relations   Influence of phosphor amount on microstructure and damage evolution of silicone/phosphor composite in light-emitting diodes packaging 期刊论文 COMPOSITES SCIENCE AND TECHNOLOGY, 2015, 卷号: 107 作者:  Chen, Xing;  Wang, Simin;  Cao, Chang;  Liu, Sheng 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/05 Functional composites  Mechanical properties  Damage mechanics  Multiscale modeling  Fractography