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The microstructures and mechanical properties of CoNiCrx medium-entropy alloys
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2024, 卷号: 891, 页码: 13
作者:
Wu, Haibin
;
Wang, Weili
;
Liu TW(刘天威)
;
Yan, Pengxu
;
Ren, Wei
收藏
  |  
浏览/下载:110/0
  |  
提交时间:2024/02/05
Medium-entropy alloys
Eutectic
Microstructure
Mechanical property
Strengthening mechanism
A high-entropy alloy syntactic foam with exceptional cryogenic and dynamic properties
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2023, 卷号: 876, 页码: 145146
作者:
Meng J(孟锦)
;
Qiao Y(乔禹)
;
Chen Y(陈艳)
;
Liu TW(刘天威)
;
Li T(李统)
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  |  
浏览/下载:9/0
  |  
提交时间:2023/09/05
High entropy alloy
Metal foams
Energy absorption
Cryogenic
Shear band
High strain rate
Ultra-strong heavy-drawn eutectic high entropy alloy wire
期刊论文
ACTA MATERIALIA, 2023, 卷号: 243, 页码: 14
作者:
Chen JX(陈金玺)
;
Li T(李统)
;
Chen Y(陈艳)
;
Cao FH(曹富华)
;
Wang HY(汪海英)
收藏
  |  
浏览/下载:93/0
  |  
提交时间:2023/02/03
Eutectic high entropy alloy wire
Mechanical properties
Gradient heterogeneous lamella structure
Cross-slip
Fabrication of ultra-fine grained Hf-based materials with superior hardness and temperature-independent electrical conductivity by a combination of high-energy ball milling and spark plasma sintering
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2022, 卷号: 925
作者:
Hao, Liyu
;
Fan, Yong
;
Shen, Shangkun
;
Liu, Xing
;
Wu, Zefeng
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  |  
浏览/下载:181/0
  |  
提交时间:2022/12/23
UFG Hf
SPS
Superior hardness
Temperature -independent electrical
conductivity
A new oospecies of Shixingoolithus (Shixingoolithus qianshanensis oosp. nov.) from the Qianshan Basin, Anhui Province, East China
期刊论文
JOURNAL OF PALAEOGEOGRAPHY-ENGLISH, 2022, 卷号: 11, 期号: 4, 页码: 629-639
作者:
He, Qing
;
Chen, Zhong-Liang
;
Zhang, Shu-Kang
;
Gui, Ze-Wen
;
Chen, Ya-Ting
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  |  
浏览/下载:4/0
  |  
提交时间:2023/10/09
Dinosaur eggs
Stalicoolithidae
Shixingoolithus qianshanensis
Upper Cretaceous
Chishan Formation
Qianshan Basin
Influence of Al2O3 content on microstructure, electrical conductivity and adhesion strength of cold sprayed Al-Al2O3 coatings on PEEK substrate
期刊论文
SURFACE & COATINGS TECHNOLOGY, 2022, 卷号: 446, 页码: 13
作者:
Liu, Hanhui
;
Tariq, Naeem ul Haq
;
Ren, Yupeng
;
Zhao, Lijia
;
Yang, Ying
收藏
  |  
浏览/下载:53/0
  |  
提交时间:2022/09/16
Cold spray
PEEK
Al-Al2O3 coating
Surface metallization
Electrical conductivity
Adhesion strength
Activated sintering effect of Fe element on tungsten via spark plasma sintering
期刊论文
NUCLEAR MATERIALS AND ENERGY, 2022, 卷号: 32
作者:
Chen, Shuai
;
Jiang, Zhizhong
;
Huang, Jihua
;
Yang, Jian
;
Ye, Zheng
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2022/12/22
Activated sintering
Spark plasma sintering
Tungsten
Solid solution
Mechanical properties
Atomic-scale icosahedral short-range ordering in a rejuvenated Zr-based bulk metallic glass upon deep cryogenic treatment
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 850, 页码: 10
作者:
Zhu, Yuhui
;
Zhou, Yongkang
;
Wang, Aimin
;
Li, Hong
;
Fu, Huameng
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2022/09/16
Bulk metallic glasses
Deep cryogenic treatment
Structural heterogeneity
Icosahedral short-range ordering
Rejuvenation
Interpretation of Compressive Strain Causing Critical Current Degradation of Bi2212 Round Wires
期刊论文
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2022, 卷号: 32
作者:
Wang, Yi-Feng
;
Jiang, Zhao-Fei
;
Zhang, Zhao-Xia
;
Gou, Xiao-Fan
收藏
  |  
浏览/下载:31/0
  |  
提交时间:2022/05/16
Bi2Sr2CaCu2Ox (Bi2212) round wires (RWs)
buckling
compressive strain
critical current degradation
tensile damage
Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:
Yu, Weiyuan
;
Li, Binbin
;
Wu, Baolei
;
Wang, Fengfeng
;
Wang, Mingkang
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2022/08/09
Binary alloys
Copper
Copper alloys
Indium alloys
Lead-free solders
Microstructure
Shear flow
Silicon carbide
Soldering
Temperature
Thermoelectric equipment
Wide band gap semiconductors
Composite solders
Electronics devices
In-45cu composite solder paste
Intermetallics compounds
Microstructures and mechanical properties
Service temperature
Shears strength
Solderpaste
Ultrasonic action time
Ultrasonic-assisted TLP
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