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华南理工大学 [19]

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大连理工大学 [14]

北京大学 [9]

清华大学 [5]

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	Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions 期刊论文 MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16 作者: Gao, Zhaoqing; Wang, Chen; Chai, Zhenbang; Chen, Yinbo; Shen, Chenyu 收藏 \| 浏览/下载：25/0 \| 提交时间：2022/07/14 Intermetallics Microstructure Temperature gradient Preferred orientation Ga-21-5In-10Sn alloys Interfaces
	Effect of Ultrasonic Vibration Coupled with Direct Current on Wetting Behavior 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2022, 卷号: 51, 期号: 3, 页码: 800-805 作者: Sun, Xuemin; Yu, Weiyuan; Wang, Fengfeng; Wu, Baolei; Wang, Yanhong 收藏 \| 浏览/下载：21/0 \| 提交时间：2022/06/20 Copper Intermetallics Nanocomposites Precipitation (chemical) Ultrasonic applications Ultrasonic waves Wetting Cu substrate Direct current method Direct-current Driving forces Intermetallics compounds Liquid solders Power current Ultrasonic-vibration Wetting balance Wetting behavior
	Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302 作者: Yu, Weiyuan; Sun, Jungang; Liu, Yun; B., Wu; Z., Lei 收藏 \| 浏览/下载：8/0 \| 提交时间：2022/02/17 Binary alloys Brazing Brazing filler metals Grain size and shape Intermetallics Melting point Microstructure Nanoparticles Synthesis (chemical) Brazing joints Composite solders Crystal planes Driving forces Interfacial intermetallics Liquidus temperature Melting process Melting properties
	Differential effects of Zn and Co solutes on the properties of Cu–Ni–Sn alloys 会议论文作者: Li, N.J.; Li, X.N.; Li, Z.M.; Yu, Q.X.; Zheng, Y.H. 收藏 \| 浏览/下载：4/0 \| 提交时间：2020/12/18 Cobalt alloys Precipitation (chemical) Solid solutionsAtomic site occupations Composition analysis Composition optimization Comprehensive properties Discontinuous precipitation Microstructure and properties Solid solution strengthening Solution-treated alloys
	Differential effects of Zn and Co solutes on the properties of Cu–Ni–Sn alloys 期刊论文 Intermetallics, 2020, 卷号: 125 作者: Li, N.J.; Li, X.N.; Li, Z.M.; Yu, Q.X.; Zheng, Y.H. 收藏 \| 浏览/下载：3/0 \| 提交时间：2022/02/17 Cobalt alloys Precipitation (chemical) Solid solutions Atomic site occupations Composition analysis Composition optimization Comprehensive properties Discontinuous precipitation Microstructure and properties Solid solution strengthening Solution-treated alloys
	Differential effects of Zn and Co solutes on the properties of Cu–Ni–Sn alloys 期刊论文 Intermetallics, 2020, 卷号: 125 作者: Li, N.J.; Li, X.N.; Li, Z.M.; Yu, Q.X.; Zheng, Y.H. 收藏 \| 浏览/下载：7/0 \| 提交时间：2020/11/14 Cobalt alloys Precipitation (chemical) Solid solutions Atomic site occupations Composition analysis Composition optimization Comprehensive properties Discontinuous precipitation Microstructure and properties Solid solution strengthening Solution-treated alloys
	Wetting Behavior of Molten SnAgCu-xTi on SiO2 Surface Under High Temperature 期刊论文 Cailiao Daobao/Materials Reports, 2020, 卷号: 34, 期号: 5, 页码: 10114-10119 作者: Wang, Jianbin; Lin, Qiaoli; Sui, Ran; Ci, Wenjuan; Ye, Changsheng 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Binary alloys Dissolution Reaction products Silica Silicon Wetting Adsorption at interfaces High melting point High temperature Liquid/solid interface Modified sessile drop method Product control Spreading dynamics Wetting behavior
	Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者: Yu, Weiyuan; Liu, Yingzong; Liu, Yun 收藏 \| 浏览/下载：8/0 \| 提交时间：2022/02/17 Binary alloys Copper compounds Interface states Intermetallics Lead-free solders Microstructure Phase interfaces Soldering Tin compounds Ultrasonic effects Unmanned aerial vehicles (UAV) Formation and evolutions Growth patterns IMC layer Interfacial intermetallics Liquid interface Nonequilibrium state Ultrasonic vibration
	Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668 作者: Sui, Ran; Li, Fuxiang; Ci, Wenjuan; Lin, Qiaoli 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Bismuth alloys Copper Copper oxides Joining Oxide films Phase interfaces Soldering Ternary alloys Tin compounds Wetting Cu intermetallics IMC layer Interfacial reactivity Interfacial structures Sessile drop method Sn-Bi alloy Spreading characteristics Ternary phase diagrams
	Reactive wetting of amorphous silica by Sn0.3Ag0.7Cu-xTi (x = 1 and 3wt.%)alloys at 800–900°C 期刊论文 Ceramics International, 2019, 卷号: 45, 期号: 10, 页码: 12920-12925 作者: Sui, Ran; Wang, Jianbin; Ci, Wenjuan; Lin, Qiaoli; Yang, Hongyu 收藏 \| 浏览/下载：26/0 \| 提交时间：2020/11/14 Dissolution Interfaces (materials) Joining Oxides Reaction products Silica Silicon Wetting Adsorption at interfaces Amorphous silica High melting point Liquid/solid interface Modified sessile drop method Product control Reactive wetting Spreading dynamics

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