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内嵌扰流式微通道TSV转接板关键工艺及其特性研究 学位论文
2016, 2016
夏雁鸣
收藏  |  浏览/下载：5/0  |  提交时间：2017/06/20
Formation of Polymer Insulation Layer (Liner) on Through Silicon Vias (TSV) with High Aspect Ratio over 5:1 by Direct Spin Coating 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Li, Liyi;  Tuan, Chia-Chi;  Moon, Kyoung-Sik;  Zhang, Guoping;  Sun, Rong
收藏  |  浏览/下载：37/0  |  提交时间：2017/01/15
Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer 其他
2016-01-01
Xia, Yanming; Ren, Kuili; Ma, Shenglin; Guan, Yong; Cai, Han; Luo, Rongfeng; Yan, Jun; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling 其他
2015-01-01
Guan, Yong; Zhu, Yunhui; Zeng, Qinghua; Ma, Shenglin; Su, Fei; Bian, Yuan; Zhong, Xiao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Electrical Simulation and Analysis of Si Interposer for 3D IC Integration 其他
2014-01-01
Sun, Xin; Miao, Min; Zhu, Yunhui; Fang, Runiu; Wang, Guanjiang; Lu, Wengao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Optimizing GPU Energy Efficiency with 3D Die-Stacking Graphics Memory and Reconfigurable Memory Interface 期刊论文
acm transactions on architecture and code optimization, 2013
Zhao, Jishen; Sun, Guangyu; Loh, Gabriel H.; Xie, Yuan
收藏  |  浏览/下载：6/0  |  提交时间：2015/11/16
Process Development and Characterization of BCB-based Redistribution Layer (RDL) for Silicon Interposer Application 其他
2012-01-01
Sun, Xin; Cui, Qinghu; Zhu, Yunhui; Ma, Shenglin; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16
The fatigue failure analysis of 3D SiP with Through Silicon Via 其他
2011-01-01
Kang, Wenping; He, Yang; Zhu, Zhiyuan; Miao, Min; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16
Design and Fabrication of a TSV Interposer for SRAM Integration 其他
2011-01-01
Zhu, Yunhui; Ma, Shenglin; Cui, Qinghu; Kang, Wenping; Zhu, Zhiyuan; Sun, Xin; Wang, Guanjiang; Zhang, Mengmeng; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16
Design and optimization of Redistribution Layer (RDL) on TSV interposer for high frequency applications 其他
2011-01-01
Cui, Qinghu; Sun, Xin; Zhu, Yunhui; Ma, Shenglin; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/16

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