CORC

浏览/检索结果: 共102条,第1-10条 帮助

限定条件                
已选(0)清除 条数/页:   排序方式:
Enhanced thermoelectric performance of Te-doped skutterudite with nano-micro-porous architecture 期刊论文
Scripta Materialia, 2019, 卷号: 159, 页码: 68-71
作者:  Yang, Houjiang;  Wen, Pengfei*;  Zhou, Xilong;  Li, Yao;  Duan, Bo
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/04
Dramatically reduced lattice thermal conductivity of Mg 2 Si thermoelectric material from nanotwinning 期刊论文
Acta Materialia, 2019, 卷号: 169, 页码: 9-14
作者:  Li, Guodong;  He, Jiangang;  An, Qi;  Morozov, Sergey I.;  Hao, Shigiang
收藏  |  浏览/下载:21/0  |  提交时间:2019/12/04
Grain Boundaries Softening Thermoelectric Oxide BiCuSeO 期刊论文
ACS Applied Materials and Interfaces, 2018, 卷号: 10, 期号: 7, 页码: 6772-6777
作者:  Li, Guodong*;  Hao, Shiqiang;  Morozov, Sergey I.;  Zhai, Pengcheng;  Zhang, Qingjie*
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/04
Enhanced thermoelectric figure of merit of Co4Sb11.5Te0.5 via a two-pronged strategy combining grain refinement and nano-inclusions 期刊论文
MATERIALS LETTERS, 2018, 卷号: 223, 页码: 190-193
作者:  Wen, Pengfei;  Yang, Houjiang;  Zhou, Xilong;  Duan, Bo;  Zhai, Pengcheng*
收藏  |  浏览/下载:14/0  |  提交时间:2019/12/04
Enhanced thermoelectric figure of merit of Co4Sb11.5Te0.5 via a two-pronged strategy combining grain refinement and nano-inclusions 期刊论文
Materials Letters, 2018, 卷号: 223, 页码: 190-193
作者:  Wen, Pengfei;  Yang, Houjiang;  Zhou, Xilong;  Duan, Bo;  Zhai, Pengcheng*
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/04
Ductile deformation mechanism in semiconductor alpha-Ag2S 期刊论文
npj Computational Materials, 2018, 卷号: 4, 期号: 1, 页码: 44-npj Computational Materialsvolume 4, Article number: 44
作者:  Li, Guodong*;  An, Qi;  Morozov, Sergey I.;  Duan, Bo;  Goddard, William A., III
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/04
Duration of Thermal Stability and Mechanical Properties of Mg2Si/Cu Thermoelectric Joints 期刊论文
Journal of Electronic Materials, 2018, 卷号: 47, 期号: 5, 页码: 2591-2599
作者:  Cai, Lanlan;  Li, Peng*;  Wang, Pei;  Luo, Qi;  Zhai, Pengcheng
收藏  |  浏览/下载:14/0  |  提交时间:2019/12/04
Determining ideal strength and failure mechanism of thermoelectric CuInTe2 through quantum mechanics 期刊论文
Journal of Materials Chemistry A, 2018, 卷号: 6, 期号: 25, 页码: 11743-11750
作者:  Li, Guodong*;  An, Qi;  Morozov, Sergey I.;  Duan, Bo;  Zhai, Pengcheng
收藏  |  浏览/下载:8/0  |  提交时间:2019/12/04
First-Principles Study on the Tensile Properties and Failure Mechanism of the CoSb3/Ti Interface 期刊论文
Journal of Electronic Materials, 2018, 卷号: 47, 期号: 6, 页码: 3210-3217
作者:  She, Wuchang;  Liu, Qiwen;  Mei, Hai;  Zhai, Pengcheng;  Li, Jun
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/04
Beneficial Effect of S-Filling on Thermoelectric Properties of SxCo4Sb11.2Te0.8 Skutterudite 期刊论文
Journal of Electronic Materials, 2018, 卷号: 47, 期号: 6, 页码: 3061-3066
作者:  Wang, Hongtao;  Duan, Bo*;  Bai, Guanghui;  Li, Jialiang;  Yu, Yue
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/04


©版权所有 ©2017 CSpace - Powered by CSpace