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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 A large-scale screen for coding variants predisposing to psoriasis 期刊论文 NATURE GENETICS, 2014, 卷号: 46, 页码: 45-+ 作者:  Tang, Huayang[1];  Jin, Xin[2,3];  Li, Yang[1];  Jiang, Hui[2];  Tang, Xianfa[1] 收藏  |  浏览/下载：14/0  |  提交时间：2019/04/25 Static thermal resistance test and simulation analysis technology for hybrid microcircuit (EI收录) 会议论文 Proceedings - International Symposium on Advanced Packaging Materials, Xiamen, China, October 25, 2011 - October 28, 2011 作者:  Zhou, Bin[1];  Qi, Xueli[1,2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 Cold rolling  Copper  Electronic equipment testing  Hybrid materials  Metal cladding  Packaging  Packaging materials  Solids   Effect of solder joint parameter on vibration fatigue reliability of high density PCB assembly (EI收录) 会议论文 ICQR2MSE 2011 - Proceedings of 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, Xi'an, China, June 17, 2011 - June 19, 2011 作者:  Qi, Xueli[1,2];  Zhou, Bin[2];  En, Yunfei[2] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/15 Finite element method  Lead  Maintenance  Modal analysis  Organic pollutants  Polychlorinated biphenyls  Printed circuit manufacture  Reliability  Safety engineering  Strain  Three dimensional  Three dimensional computer graphics   Effect of Solder Joint Parameter on Vibration Fatigue Reliability of High Density PCB Assembly (CPCI-S收录) 会议论文 2011 INTERNATIONAL CONFERENCE ON QUALITY, RELIABILITY, RISK, MAINTENANCE, AND SAFETY ENGINEERING (ICQR2MSE) 作者:  Qi, Xueli[1];  Zhou, Bin;  En, Yunfei 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/15 PCB assembly  solder joint parameter  random vibration  fatigue reliability   Reliability test and analysis for vibration-induced solder joint failure of PBGA assembly (EI收录) 会议论文 ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011 作者:  Zhou, Bin[1];  En, Yunfei[1];  Qi, Xueli[1,2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Automobile testing  Cracks  Deformation  Electronics packaging  Packaging  Reliability analysis  Soldering  Stress concentration  Testing  Time series analysis   Study of vibration reliability test and simulation for high density PBGA assembly (EI收录) 会议论文 ICQR2MSE 2011 - Proceedings of 2011 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, Xi'an, China, June 17, 2011 - June 19, 2011 作者:  Zhou, Bin[1];  Qi, Xueli[1,2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 Cracks  Failure analysis  Fatigue of materials  Maintenance  Polychlorinated biphenyls  Printed circuit manufacture  Reliability analysis  Safety engineering  Testing   Effect of Fixation Method on Solder Joint Vibration Fatigue Reliability of High Density PCB Assembly (CPCI-S收录) 会议论文 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Qi, Xueli[1,2];  Zhou, Bin[2];  Li, Guoyuan[1];  Zhang, Pengfei[1];  En, Yunfei[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Effect of fixation method on solder joint vibration fatigue reliability of high density PCB assembly (EI收录) 会议论文 ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011 作者:  Qi, Xueli[1,2];  Zhou, Bin[2];  Li, Guoyuan[1];  Zhang, Pengfei[1];  En, Yunfei[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Electronics packaging  Finite element method  Modal analysis  Organic pollutants  Packaging  Polychlorinated biphenyls  Printed circuit manufacture  Reliability  Screws  Three dimensional  Three dimensional computer graphics