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北京航空航天大学 [18]
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会议论文 [10]
期刊论文 [8]
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2019 [1]
2018 [5]
2017 [2]
2016 [3]
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2013 [2]
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专题:北京航空航天大学
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Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method
期刊论文
IEEE ACCESS, 2019, 卷号: 7, 页码: 68495-68502
作者:
Chen, Wei
;
Fan, Jiajie
;
Qian, Cheng
;
Pu, Bin
;
Fan, Xuejun
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/30
Light-emitting diode
luminous flux response surface model
spectral power distribution
luminous efficacy decay
degradation mechanism
Thermal Management on IGBT Power Electronic Devices and Modules
期刊论文
IEEE ACCESS, 2018, 卷号: 6, 页码: 12868-12884
作者:
Qian, Cheng
;
Gheitaghy, Amir Mirza
;
Fan, Jiajie
;
Tang, Hongyu
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/30
Power electronics
IGBT
thermal management
cooling
qualifications
Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages
期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1254-1262
作者:
Jiang, Chengshuo
;
Fan, Jiajie
;
Qian, Cheng
;
Zhang, Hao
;
Fan, Xuejun
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/30
Chip-scale package (CSP)
flip-chip die attach
high-power light-emitting diode (LED)
reliability
voids
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
期刊论文
MICROELECTRONICS RELIABILITY, 2018, 卷号: 84, 页码: 140-148
作者:
Fan, Jiajie
;
Cao, Jianwu
;
Yu, Chaohua
;
Qian, Cheng
;
Fan, Xuejun
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/12/30
LED
Wafer level chip scale package
Chip-on-Board
Tunable color temperatures
Luminous flux modeling
Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Wang, Zhen
;
Fan, Jiajie
;
Liu, Jie
;
Hu, Aihua
;
Qian, Cheng
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/12/30
LED
Chip scale package
Phosphor/silicone composites
Viscosity
Optimal cure process
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
会议论文
MICROELECTRONICS RELIABILITY, 2018-05-01
作者:
Fan, Jiajie
;
Cao, Jianwu
;
Yu, Chaohua
;
Qian, Cheng
;
Fan, Xuejun
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/30
LED
Wafer level chip scale package
Chip-on-Board
Tunable color temperatures
Luminous flux modeling
Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method
期刊论文
MATERIALS, 2017, 卷号: 10
作者:
Qian, Cheng
;
Fan, Jiajie
;
Fang, Jiayi
;
Yu, Chaohua
;
Ren, Yi
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/12/30
light-emitting diode
chip scale package
accelerated aging
step stress test
reliability qualification
Microstructure and mechanical properties of laser melting deposited GW103K Mg-RE alloy
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 687, 页码: 281-287
作者:
Liao, Haiguang
;
Fu, Penghuai
;
Peng, Liming
;
Li, Jia
;
Zhang, Shuquan
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/30
Laser melting deposition
Mg rare earth alloy
Microstructure
Mechanical property
Grain coarsening
GdH2
A Novel Disturbance Observer for Attitude Control of Flexible Spacecraft
会议论文
12th World Congress on Intelligent Control and Automation (WCICA), Guilin, PEOPLES R CHINA, 2016-01-01
作者:
Wang, Zhaohui
;
Jia, Yinghong
;
Xu, Shijie
;
Zhang, Guoqi
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/30
ACTIVE VIBRATION SUPPRESSION IN FLEXIBLE SPACECRAFT DURING ATTITUDE MANEUVER
会议论文
SPACEFLIGHT MECHANICS 2016, PTS I-IV, 2016-01-01
作者:
Wang, Zhaohui
;
Xu, Ming
;
Xu, Shijie
;
Jia, Shiyuan
;
Zhang, Guoqi
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/30
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