QQ客服 官方微博 反馈留言

浏览/检索结果: 共5条，第1-5条 帮助 限定条件 专题：北京航空航天大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 In Situ Observation and Electrochemical Study of Encapsulated Sulfur Nanoparticles by MoS2 Flakes 期刊论文 JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2017, 卷号: 139, 页码: 10133-10141 作者:  Tang, Wei;  Chen, Zhongxin;  Tian, Bingbing;  Lee, Hyun-Wook;  Zhao, Xiaoxu 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/30 Influence of Stress on the Electromigration Life of Solder 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 卷号: 7, 页码: 762-767 作者:  Zhang, Zheng;  Liu, Qingyi;  Pan, Xiaoxu;  Wang, Qizhi;  Su, Fei 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 Electromigration (EM)  mean time to failure (MTTF)  microsolder  reliability   Simulation of Electromigration induced stress of solder 会议论文 37th IEEE International Electronics Manufacturing Technology Conference (IEMT) / 18th Electronics Materials and Packaging (EMAP) Conference, MALAYSIA, 2016-09-20 作者:  Su, Fei;  Pan, Xiaoxu;  Zhang, Zheng;  Liu, Qingyi 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/30 Electromigration  Stress  Solder  finite element   Influence of stress on the electromigration life of solder 会议论文 37th IEEE International Electronics Manufacturing Technology Conference (IEMT) / 18th Electronics Materials and Packaging (EMAP) Conference, MALAYSIA, 2016-09-20 作者:  Zhang, Zheng;  Liu, Qingyi;  Pan, Xiaoxu;  Wang, Qizhi;  Su, Fei 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/30 Development and Application of a Micro-infrared Photoelasticity System for Stress Evaluation of Through-silicon Vias (TSV) 会议论文 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015-01-01 作者:  Su, Fei;  Lan, Tianbao;  Pan, Xiaoxu;  Zhang, Zheng 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/06 Through-Silicon Vias (TSV)  stress  infrared photoelasticity  finite element analysis  hybrid method