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CORC

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Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
New maximum entropy-based algorithm for structural design optimization 期刊论文
APPLIED MATHEMATICAL MODELLING, 2019, 卷号: 66, 页码: 26-40
作者:  Li, Gang;  Zhou, Chunxiao;  Zeng, Yan;  He, Wanxin;  Li, Haoran
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Electrochemical migration behavior of Sn-based lead-free solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 14695-14702
作者:  Qi, Xiao;  Ma, Haoran;  Wang, Chen;  Shang, Shengyan;  Li, Xiaogan
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02
Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn-xTiO(2) composite solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 18828-18837
作者:  Liu, Zhiyuan;  Ma, Haoran;  Shang, Shengyan;  Wang, Yunpeng;  Li, Xiaogan
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/02
Instrument for fine control of drop-on-demand electrohydrodynamic jet printing by current measurement 期刊论文
Review of Scientific Instruments, 2019, 卷号: 90
作者:  Li, Kai;  Wang, Dazhi;  Yi, Shanshan;  Jia, Haoran;  Qian, Jianghong
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02
Cascaded network with deep intensity manipulation for scene understanding 期刊论文
COMPUTER ANIMATION AND VIRTUAL WORLDS, 2019, 卷号: 30
作者:  Yang, Xin;  Wang, Haoran;  Chen, Shaozhe;  Piao, Xinglin;  Zhou, Dongsheng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 15964-15971
作者:  Zhu, Zhidan;  Ma, Haoran;  Shang, Shengyan;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple reflows 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ma, Haoran;  Yao, Jinye;  Wang, Chen;  Shang, Shengyan;  Wang, Yunpeng
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Study on Electrochemical Migration of Sn-0.7Cu 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Qi, Xiao;  Ma, Haoran;  Huang, Ru;  Yao, Jinye;  Shang, Shengyan
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
The Improved Delivery to Breast Cancer Based on a Novel Nanocarrier Modified with High-Affinity Peptides Discovered by Phage Display 期刊论文
ADVANCED HEALTHCARE MATERIALS, 2018, 卷号: 7, 页码: e1800269
作者:  Zhang, Haoran;  Guo, Zhaoming;  He, Bing;  Dai, Wenbing;  Zhang, Hua
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02

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