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CLASSIFICATION OF WILLMORE TWO-SPHERES IN THE 5-DIMENSIONAL SPHERE 其他
2017-01-01
Ma, Xiang; Wang, Changping; Wang, Peng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Single-Junction Binary-Blend Nonfullerene Polymer Solar Cells with 12.1% Efficiency 期刊论文
ADVANCED MATERIALS, 2017
Zhao, Fuwen; Dai, Shuixing; Wu, Yang; Zhang, Qianqian; Wang, Jiayu; Jiang, Li; Ling, Qidan; Wei, Zhixiang; Ma, Wei; You, Wei; Wang, Chunru; Zhan, Xiaowei
收藏  |  浏览/下载：11/0  |  提交时间：2017/12/03
WINTGEN IDEAL SUBMANIFOLDS OF CODEVIENSION TWO, COMPLEX CURVES, AND MOBIUS GEOMETRY 其他
2016-01-01
Li, Tongzhu; Ma, Xiang; Wang, Changping; Xie, Zhenxiao
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Design and Characterization of Petaloid Hollow Cu Interconnection for Interposer 其他
2016-01-01
Xia, Yanming; Ren, Kuili; Ma, Shenglin; Guan, Yong; Cai, Han; Luo, Rongfeng; Yan, Jun; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Fabrication and Filling Quality Optimization of the High Density and Small Size Through Silicon Via Array for Three-dimensional Packaging 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Parametric Study of DRIE Process for Enhancing the Profile-preserving Property of Square Through Silicon Via 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Fine-pitch through-silicon via integration with self-aligned back-side benzocyclobutene passivation layer 期刊论文
MICRO & NANO LETTERS, 2016
Guan, Yong; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Interposer Fabrication with Annular Copper TSV and Multi-layered Redistribution Layer 其他
2016-01-01
Guan, Yong; Ma, Shenglin; Zeng, Qinghua; Meng, Wei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03

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