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科研机构
华南理工大学 [7]
内容类型
会议 [7]
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Familial Sudden Cardiac Death Caused by DSG2 Mutation as Genetic Backgrounds: Whole Exome Sequencing and Valid Therapy of Catheter Ablation (CPCI-S收录)
会议
作者:
Lin, Yubi[1,2,3,4,5,6,7]
;
Zhang, Qianhuan[1,2,3,4,5,6]
;
Chen, Jia[8]
;
Feng, Ruiling[1,2,3,4,5,6,7]
;
He, Siqi[1,2,3,4,5,6,7]
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/04/11
SCN5A Mutants Associated with Familial Cardiac Sodium Overlap Syndrome Characterized as Sick Sinus Syndrome, Atrial Fibrillation, Brugada Syn (CPCI-S收录)
会议
作者:
Lin, Yubi[1,2]
;
Deng, Chunyu[1,2]
;
Zhan, XianZhang[1,2]
;
Xu, Zhe[3]
;
Zhu, Jiening[1,2]
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2019/04/11
Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
lead-free solder joint
interfacial reaction
microstructure
BGA
differential scanning calorimetry
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Intermetallics
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Packaging materials
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Thermal expansion
OBSERVATION OF SUB-20NM LINE-DEFECTS IN GRAPHENE BY FRICTION FORCE MICROSCOPY (CPCI-S收录)
会议
作者:
Jia, Yuehui[1,2]
;
Wang, Zidong[2]
;
Gong, Xin[3]
;
Peng, Pei[2]
;
Ren, Liming[2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Flip chip devices
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Size determination
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/11
BGA solder joint
size effect
lead-free solder
interfacial reaction
microstructure
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