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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Contrast experimental study on energy conversion of the point absorber wave energy converter (EI收录) 会议 Guangzhou, China, 作者:  Lin, Li Qun[1];  Chen, Zhi Xin[1];  Wu, Bi Jun[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Collector efficiency  Conversion efficiency  Digital arithmetic  Electric generators  Energy conversion  Equipment  Hydraulic machinery  Hydraulic motors  Hydroelectric generators  Power takeoffs  Wave power   The Elderly's Falling Motion Recognition Based on Kinect and Wearable Sensors (CPCI-S收录) 会议 作者:  Pang Nana[1];  Min, Dong[1];  Yue, Zhao[1];  Xin, Chen[1];  Sheng, Bi[1] 收藏  |  浏览/下载：12/0  |  提交时间：2019/04/11 Wearable device  Falling motion recognition  Elderly   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion   Phase Field Simulation of Segregation of the Bi-riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing (CPCI-S收录) 会议 作者:  Liang, Shui-Bao[1];  Ke, Chang-Bo[1];  Ma, Wen-Jing[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 segregation  electromigration  Sn-Bi solder  interconnect  phase field simulation   Research on wind-induced torsional control with annular damper for high-rise building (CPCI-S收录) 会议 作者:  Liu Feipeng[1,2];  Liu Ruyi[3];  Bi Haifeng[3];  Xin Mingming[1];  Xu Jiayun[1] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/11 High-rise building  large eccentric structure  torsional vibration  annular damper  vibration control   The elderly’s falling motion recognition based on kinect and wearable sensors (EI收录) 会议 Shanghai, China, 作者:  Nana, Pang[1];  Min, Dong[1];  Yue, Zhao[1];  Xin, Chen[1];  Sheng, Bi[1] 收藏  |  浏览/下载：17/0  |  提交时间：2019/04/11 Motion analysis  Motion estimation  Support vector machines  Wearable technology   Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interc (CPCI-S收录) 会议 作者:  Liang, Shui-Bao;  Ke, Chang-Bo;  Tan, Meng-Ying;  Zhou, Min-Bo;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 electromigration  microstructure evolution  phase segregation  Cu/Sn-Bi/Cu interconnect  phase field simulation   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (CPCI-S收录) 会议 作者:  Huang, Lia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Sn58Bi  Sn3.0Ag0.5Cu  Mixed solder joint  Microstructure  interfacial reaction  Ball grid array   Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process (CPCI-S收录) 会议 作者:  Tan, Meng-Ying;  Zhou, Min-Bo;  Huang, Lia-Qiang;  Ma, Fa-Qian;  Ma, Xiao 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 surface defect  solder ball spattering  Sn-Bi solder paste  reflow soldering process