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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Research on Process of Multi-point Micro Laser Shock Forming 会议论文 PROCEEDINGS OF THE 2016 INTERNATIONAL FORUM ON MECHANICAL, CONTROL AND AUTOMATION (IFMCA 2016), 2017-01-01 作者:  Fan, Yujie[1];  Guo, Erbin[2];  Zhou, Jianzhong[3];  Yin, Kaiting[4];  Cui, Pengfei[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/24 Micro laser shock forming  Impact deformation  Copper   Research on Process of Multi-point Micro Laser Shock Forming 会议论文 International Forum on Mechanical, Control and Automation (IFMCA) 作者:  Fan, Yujie[1];  Guo, Erbin[2];  Zhou, Jianzhong[3];  Yin, Kaiting[4];  Cui, Pengfei[5] 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/24 Micro laser shock forming  Impact deformation  Copper   Influence of Laser Shock Texturing on W9 Steel Surface Friction Property 会议论文 International Conference on Materials Sciences and Nanomaterials (ICMSN), 2017-07-14 作者:  Fan, Yujie[1];  Cui, Pengfei[2];  Zhou, Jianzhong[3];  Dai, Yibin[4];  Guo, Erbin[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/24 Three-dimensional computations of the hydrodynamics and mass transfer during solution growth of KDP crystal with a planetary motion 会议论文 Spa, BELGIUM, NOV 15-18, 2015 作者:  Hu, Zhitao;  Li, Mingwei[2];  Wang, Pengfei;  Zhou, Chuan;  Yin, Huawei 收藏  |  浏览/下载：0/0  |  提交时间：2019/11/28 Protective effect of vitamin E against acute kidney injury 会议论文 Shanghai, PEOPLES R CHINA, AUG 18-21, 2015 作者:  Liu, Pengfei[1,2,3];  Feng, Yetong[4];  Wang, Yi[1,2];  Zhou, Yulai[1,2];  Zhao, Lei[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/03 Effect of Fixation Method on Solder Joint Vibration Fatigue Reliability of High Density PCB Assembly (CPCI-S收录) 会议论文 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) 作者:  Qi, Xueli[1,2];  Zhou, Bin[2];  Li, Guoyuan[1];  Zhang, Pengfei[1];  En, Yunfei[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Effect of fixation method on solder joint vibration fatigue reliability of high density PCB assembly (EI收录) 会议论文 ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011 作者:  Qi, Xueli[1,2];  Zhou, Bin[2];  Li, Guoyuan[1];  Zhang, Pengfei[1];  En, Yunfei[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Electronics packaging  Finite element method  Modal analysis  Organic pollutants  Packaging  Polychlorinated biphenyls  Printed circuit manufacture  Reliability  Screws  Three dimensional  Three dimensional computer graphics   LIGHT-FIELD FLOW: A SUBPIXEL-ACCURACY DEPTH FLOW ESTIMATION WITH GEOMETRIC OCCLUSION MODEL FROM A SINGLE LIGHT-FIELD IMAGE 会议论文 Beijing, PEOPLES R CHINA, SEP 17-20, 2017 作者:  Zhou, Wenhui[1];  Li, Pengfei[1];  Lumsdaine, Andrew[2];  Lin, Lili[3] 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/26 Light-field flow: A subpixel-accuracy depth flow estimation with geometric occlusion model from a single light-field image 会议论文 Beijing, China, September 17, 2017 - September 20, 2017 作者:  Zhou, Wenhui[1];  Li, Pengfei[1];  Lumsdaine, Andrew[2];  Lin, Lili[3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/26