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Semi-Supervised Segmentation of Mitochondria from Electron Microscopy Images Using Spatial Continuity 会议论文
Kolkata, India, 28-31 March 2022
作者:  Yunpeng Xiao SEARCH Conferences >2022 IEEE 19th International ... Semi-Supervised Segmentation of Mitochondria from Electron Microscopy Images Using Spatial Continuity Publisher: IEEE Cite This PDF Yunpeng Xiao;  Youpeng Zhao;  Ge Yang
收藏  |  浏览/下载：9/0  |  提交时间：2022/06/30
Efficacy and safety of IBI305 compared with bevacizumab in advanced non-squamous NSCLC patients as first-line treatment in a randomized, double-blind, phase III study. 会议论文
作者:  Zhang, Li;  Wu, Bin;  Huang, Linian;  Shi, Meiqi;  Liu, Yunpeng
收藏  |  浏览/下载：20/0  |  提交时间：2019/12/05
Efficacy and safety of IBI305 compared with bevacizumab in advanced non-squamous NSCLC patients as first-line treatment in a randomized, double-blind, phase III study. 会议论文
作者:  Zhang, Li;  Wu, Bin;  Huang, Linian;  Shi, Meiqi;  Liu, Yunpeng
收藏  |  浏览/下载：12/0  |  提交时间：2019/12/05
A Combined Model Based on GM and SARIMA: An Example of Excavator Demand Forecasting 会议论文
4th IEEE International Conference on Cloud Computing and Big Data Analysis (ICCCBDA), APR 12-15, 2019
作者:  Zhao, Jing;  Wang, Zhaohui;  Zhang, Zhongge;  Han, Yunpeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/31
Stability of Multilayered Ag/Ag3Sn/Sn Films Noncyanide Electroplateded for high-reflective back-electrode 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Ji, Shengnan;  Ma, Haitao;  Wang, Chen;  Zhao, Ning;  Wang, Yunpeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Growth mechanism of Cu3Sn grains in the (111) Cu/Sn/Cu micro interconnects 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Stability of Multilayered Ag/Ag3Sn/Sn Films Non-cyanide Electroplateded for high-reflective back-electrode 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ji, Shengnan;  Wang, Chen;  Wang, Yunpeng;  Ma, Haitao;  Zhao, Ning
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Aging 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/02
Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Chen, Shi;  Liu, Chunying;  Zhong, Yi;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02

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