| Stability of Multilayered Ag/Ag3Sn/Sn Films Noncyanide Electroplateded for high-reflective back-electrode | |
| Ji, Shengnan; Ma, Haitao; Wang, Chen; Zhao, Ning; Wang, Yunpeng | |
| 2018 | |
| 会议名称 | 19th International Conference on Electronic Packaging Technology, ICEPT 2018 |
| 会议日期 | 2018-08-08 |
| 会议地点 | Shanghai, China |
| 页码 | 396-399 |
| 会议录 | 19th International Conference on Electronic Packaging Technology, ICEPT 2018
 |
| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3234733 |
| 专题 | 大连理工大学 |
| 作者单位 | Department of Materials Science and Engineering, Dalian University of Technology, Dalian, China |
| 推荐引用方式 GB/T 7714 | Ji, Shengnan,Ma, Haitao,Wang, Chen,et al. Stability of Multilayered Ag/Ag3Sn/Sn Films Noncyanide Electroplateded for high-reflective back-electrode[C]. 见:19th International Conference on Electronic Packaging Technology, ICEPT 2018. Shanghai, China. 2018-08-08. |
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