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CORC

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An exchangeable end effector for multi-part-assembly system 会议论文
TENTH INTERNATIONAL SYMPOSIUM ON PRECISION ENGINEERING MEASUREMENTS AND INSTRUMENTATION, 2019-01-01
作者:  Sun, Shengsheng;  Luo, Yi;  Qiao, Xiaoxu;  Wang, Xiaodong
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Force control and visual measurement in precision assembly 会议论文
TENTH INTERNATIONAL SYMPOSIUM ON PRECISION ENGINEERING MEASUREMENTS AND INSTRUMENTATION, 2019-01-01
作者:  Li, Yawei;  Wang, Xiaodong;  Luo, Yi;  Sun, Shengsheng
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
The Measurement Technology for Precision Peg-in-hole Assembly 会议论文
TENTH INTERNATIONAL SYMPOSIUM ON PRECISION ENGINEERING MEASUREMENTS AND INSTRUMENTATION, 2019-01-01
作者:  Wang, Xiaodong;  Wang, Xingyuan;  Ren, Tongqun;  Wang, Yue;  Lou, Zhifeng
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02
Indium Sealing of Metal Shell for Precision Devices Packaging 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Wang, Xiaodong;  Yu, Xiaoli;  Chen, Xiaoyi;  Luo, Yi
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Packaging flat micro heat pipe using low melting point alloy 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Luo, Yi;  Jia, Chen;  Li, Congming;  Wang, Xiaodong
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02
Road extraction based on KFCM clustering and morphological operations 会议论文
30th Chinese Control and Decision Conference, CCDC 2018, Shenyang, China, 2018-06-09
作者:  Luo, Rui;  Liu, Xiaodong;  Ren, Yan;  Ao, Tianci;  Xi, Jie
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
An approach to scene matching algorithm for UAV autonomous navigation 会议论文
30th Chinese Control and Decision Conference, CCDC 2018, Shenyang, China, 2018-06-09
作者:  Ao, Tianci;  Liu, Xiaodong;  Ren, Yan;  Luo, Rui;  Xi, Jie
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Automatic flatness detection system for micro part 会议论文
7th International Symposium on Precision Mechanical Measurements (ISPMM), Xiamen, PEOPLES R CHINA, 2015-08-08
作者:  Luo, Yi;  Wang, Xiaodong;  Shan, Zhendong;  Li, Kehong
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Comparison of thermal characteristics of Light-emitting Diode chips and electrical heating source 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Wang, Xiaodong;  Zhou, Chuanpeng;  Li, Congming;  Li, Zhixin;  Luo, Yi
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
A silicon-aluminum micro heat sink for light emitting diode (LED) chips 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Luo, Yi;  Yu, Beike;  Shan, Qing;  Wang, Xiaodong
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09

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