| Packaging flat micro heat pipe using low melting point alloy | |
| Luo, Yi; Jia, Chen; Li, Congming; Wang, Xiaodong | |
| 2018 | |
| 会议名称 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 会议日期 | 2018-01-01 |
| 关键词 | flat micro heat pipe packaging low melting point alloy working fluid charge |
| 页码 | 770-773 |
| 会议录 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3253326 |
| 专题 | 大连理工大学 |
| 作者单位 | Dalian Univ Technol, Lab Micro Nano Technol & Syst Liaoning Prov, Dalian, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Luo, Yi,Jia, Chen,Li, Congming,et al. Packaging flat micro heat pipe using low melting point alloy[C]. 见:2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2018-01-01. |
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