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An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5]
收藏  |  浏览/下载:17/0  |  提交时间:2019/04/24
A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds 期刊论文
FLEXIBLE AND PRINTED ELECTRONICS, 2017, 卷号: 2
作者:  Jiang, Di[1];  Sun, Shuangxi[2];  Edwards, Michael[3];  Jeppson, Kjell[4];  Wang, Nan[5]
收藏  |  浏览/下载:25/0  |  提交时间:2019/04/24
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载:41/0  |  提交时间:2019/04/24
Graphene-CNT Hybrid Material as Potential Thermal Solution in Electronics Applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Darmawan, Christian Chandra[1];  Ye, Lilei[2];  Samani, Majid Kabiri[3];  Fu, Yifeng[4];  Liu, Johan[5]
收藏  |  浏览/下载:16/0  |  提交时间:2019/04/24
Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Nylander, Andreas[1];  Fu, Yifeng[2];  Ye, Lilei[3];  Liu, Johan[4]
收藏  |  浏览/下载:27/0  |  提交时间:2019/04/24
Chemical vapor deposition grown graphene on Cu-Pt alloys 期刊论文
MATERIALS LETTERS, 2017, 卷号: 193, 页码: 255-258
作者:  Zhang, Yong[1];  Fu, Yifeng[2];  Edwards, Michael[3];  Jeppson, Kjell[4];  Ye, Lilei[5]
收藏  |  浏览/下载:27/0  |  提交时间:2019/04/24


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