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科研机构
上海大学 [6]
内容类型
会议论文 [4]
期刊论文 [2]
发表日期
2017 [6]
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An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Chen, Shujing[1]
;
Shan, Bo[2]
;
Yang, Yiqun[3]
;
Yuan, Guangjie[4]
;
Huang, Shirong[5]
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2019/04/24
Interconnect
CNTs based bumps
CNTs basednTSVs
resistivity
CNTs-Cu nanocomposite
A flexible and stackable 3D interconnect system using growth-engineered carbon nanotube scaffolds
期刊论文
FLEXIBLE AND PRINTED ELECTRONICS, 2017, 卷号: 2
作者:
Jiang, Di[1]
;
Sun, Shuangxi[2]
;
Edwards, Michael[3]
;
Jeppson, Kjell[4]
;
Wang, Nan[5]
收藏
  |  
浏览/下载:25/0
  |  
提交时间:2019/04/24
carbon nanotubes
flexible electronics
interconnect
3D integration
Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Huang, Shirong[1]
;
Ke, Wei[2]
;
Yang, Yiqun[3]
;
Ye, Hui[4]
;
Chen, Shujing[5]
收藏
  |  
浏览/下载:41/0
  |  
提交时间:2019/04/24
Graphene protection barrier
Cu-Plated PCB
Reliability
Graphene-CNT Hybrid Material as Potential Thermal Solution in Electronics Applications
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Darmawan, Christian Chandra[1]
;
Ye, Lilei[2]
;
Samani, Majid Kabiri[3]
;
Fu, Yifeng[4]
;
Liu, Johan[5]
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2019/04/24
Graphene
CNT
Covalent bonding
Thermal Management
Thermal Conductivity
Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications
会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:
Nylander, Andreas[1]
;
Fu, Yifeng[2]
;
Ye, Lilei[3]
;
Liu, Johan[4]
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  |  
浏览/下载:27/0
  |  
提交时间:2019/04/24
Thermal interface materials
thermal management
electronics cooling
carbon nanotube
functionalization
Chemical vapor deposition grown graphene on Cu-Pt alloys
期刊论文
MATERIALS LETTERS, 2017, 卷号: 193, 页码: 255-258
作者:
Zhang, Yong[1]
;
Fu, Yifeng[2]
;
Edwards, Michael[3]
;
Jeppson, Kjell[4]
;
Ye, Lilei[5]
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2019/04/24
Graphene
Cu-Pt
Alloy
Chemical vapor deposition
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