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Packaging IGBT modules by rapid sintering of nanosilver paste in a current way 会议论文
2017 international conference on electronics packaging, icep 2017, tendo, yamagata, japan, 2017-04-19
作者:  Xie, Yijing;  Mei, Yunhui;  Feng, Shuangtao;  Zhang, Pu;  Zhang, Long
收藏  |  浏览/下载:98/0  |  提交时间:2017/07/18


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