Packaging IGBT modules by rapid sintering of nanosilver paste in a current way | |
Xie, Yijing1; Mei, Yunhui1; Feng, Shuangtao1; Zhang, Pu2; Zhang, Long3; Yang, Yingkun3 | |
2017-06-05 | |
会议名称 | 2017 international conference on electronics packaging, icep 2017 |
会议日期 | 2017-04-19 |
会议地点 | tendo, yamagata, japan |
页码 | 112-116 |
通讯作者 | mei, yunhui (yunhui@tju.edu.cn) |
英文摘要 | rapid sintering of nanosilver paste had been proposed to bond power chips in our previous work. it seems a potential good way to improve the efficiency of power module manufacturing because of the much shorter sintering time, i.e., 15 seconds. in this study, we tried the way of rapid sintering of nanosilver paste for bonding power chips in order to verify the feasibility of the rapid sintering method. both the static and the dynamic performance of the igbt modules using rapid sintered nanosilver as die attachment have been characterized at both room temperature and 150oc. the results shows that this rapid sintering way could be used to bond power chips in a much shorter time to fabricate igbt modules using nanosilver paste because of the comparable static and dynamic electrical properties as those of commercial igbt modules with the same power rating from macmic and infineon. © 2017 japan institute of electronics packaging. |
收录类别 | EI |
产权排序 | 2 |
会议录 | 2017 international conference on electronics packaging, icep 2017 |
会议录出版者 | institute of electrical and electronics engineers inc. |
语种 | 英语 |
ISBN号 | 9784990218836 |
内容类型 | 会议论文 |
源URL | [http://ir.opt.ac.cn/handle/181661/29091] |
专题 | 西安光学精密机械研究所_瞬态光学技术国家重点实验室 |
作者单位 | 1.School of Material Science and Engineering, Tianjin Key Laboratory of Advanced Joining Technology, Tianjin University, Tianjin, China 2.State Key Laboratory of Transient Optics and Photonics, Chinese Academy of Sciences, Xi'an, China 3.Microsystem and Terahertz Research Center, China Academy of Engineering Physics, Chengdu; 610200, China |
推荐引用方式 GB/T 7714 | Xie, Yijing,Mei, Yunhui,Feng, Shuangtao,et al. Packaging IGBT modules by rapid sintering of nanosilver paste in a current way[C]. 见:2017 international conference on electronics packaging, icep 2017. tendo, yamagata, japan. 2017-04-19. |
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