CORC

浏览/检索结果: 共7条,第1-7条 帮助

限定条件    
已选(0)清除 条数/页:   排序方式:
Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2015, 卷号: 44, 页码: 2898-2907
作者:  Mu, Wei[1];  Sun, Shuangxi[2];  Jiang, Di[3];  Fu, Yifeng[4];  Edwards, Michael[5]
收藏  |  浏览/下载:17/0  |  提交时间:2019/04/26
Reliability of Graphene-based Films Used for High Power Electronics Packaging 会议论文
16 int conf elect packaging technology, 2015-01-01
作者:  Huang, Shirong[1];  Zhang, Yong[2];  Wang, Nan[3];  Wang, Ning[4];  Fu, Yifeng[5]
收藏  |  浏览/下载:16/0  |  提交时间:2019/04/26
Combination of positive charges and honeycomb pores to promote MC3T3-E1 cell behaviour 期刊论文
RSC ADVANCES, 2015, 卷号: 5, 页码: 42276-42286
作者:  Zhao, Changhong[1];  Pan, Changjiang[2];  Sandstedt, Joakim[3];  Fu, Yifeng[4];  Lindahl, Anders[5]
收藏  |  浏览/下载:19/0  |  提交时间:2019/04/26
Vertically Stacked Carbon Nanotube-Based Interconnects for Through Silicon Via Application 期刊论文
IEEE ELECTRON DEVICE LETTERS, 2015, 卷号: 36, 页码: 499-501
作者:  Jiang, Di[1];  Mu, Wei[2];  Chen, Si[3];  Fu, Yifeng[4];  Jeppson, Kjell[5]
收藏  |  浏览/下载:17/0  |  提交时间:2019/04/26
Flexible Multifunctionalized Carbon Nanotubes-Based Hybrid Nanowires 期刊论文
ADVANCED FUNCTIONAL MATERIALS, 2015, 卷号: 25, 页码: 4135-4143
作者:  Wang, Nan[1];  Jiang, Di[2];  Ye, Lilei[3];  Murugesan, Murali[4];  Edwards, Michael[5]
收藏  |  浏览/下载:15/0  |  提交时间:2019/04/26
Cooling Hot Spots by Hexagonal Boron Nitride Heat Spreaders 会议论文
IEEE 65th Electronic Components and Technology Conference (ECTC), 2015-01-01
作者:  Sun, Shuangxi[1];  Bao, Jie[2];  Mu, Wei[3];  Fu, Yifeng[4];  Zhang, Yong[5]
收藏  |  浏览/下载:17/0  |  提交时间:2019/04/26
Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application 期刊论文
ADVANCED FUNCTIONAL MATERIALS, 2015, 卷号: 25, 页码: 4430-4435
作者:  Zhang, Yong[1];  Han, Haoxue[2];  Wang, Nan[3];  Zhang, Pengtu[4];  Fu, Yifeng[5]
收藏  |  浏览/下载:16/0  |  提交时间:2019/04/30


©版权所有 ©2017 CSpace - Powered by CSpace