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浏览/检索结果: 共15条，第1-10条 帮助 限定条件 发表日期：2014     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Carbon nanotube/solder hybrid structure for interconnect applications 会议论文 5th Electronics System-Integration Technology Conference, ESTC 2014, 2014-09-16 作者:  Jiang, Di[1];  Sun, Shuangxi[2];  Mu, Wei[3];  Fu, Yifeng[4];  Liu, Johan[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30 Use of graphene-based films for hot spot cooling 会议论文 5th Electronics System-Integration Technology Conference, ESTC 2014, 2014-09-16 作者:  Zhang, Yong[1];  Zhang, Pengtu[2];  Wang, Nan[3];  Fu, Yifeng[4];  Liu, Johan[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 Characterization of nano-enhanced interconnect materials for fine pitch assembly 期刊论文 Soldering and Surface Mount Technology, 2014, 卷号: 26, 页码: 12-17 作者:  Zhang, Yan[1];  Sitek, Janusz[2];  Fan, Jing-Yu[3];  Ma, Shiwei[4];  Koscielski, Marek[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30 CNT  Conductive adhesives  Flexible PCBs  Nano-Ag paste   Study on the Verification of IR and RTD Methods Applied in the Thermal Measurement of High Power Chips 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), 2014-08-12 作者:  Zhang, Yan[1];  He, Chu-yun[2];  Zhang, Yong[3];  Fan, Jing-yu[4];  Fu, Yifeng[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30 thermal measurement  IR  RTD   Reliability of carbon nanotube bumps for chip on glass application 会议论文 5th Electronics System-Integration Technology Conference, ESTC 2014, 2014-09-16 作者:  Fan, Xiaogang[1];  Li, Xiaolei[2];  Mu, Wei[3];  Jiang, Di[4];  Huang, Shirong[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 A solder joint structure with vertically aligned carbon nanofibres as reinforcements 会议论文 5th Electronics System-Integration Technology Conference, ESTC 2014, 2014-09-16 作者:  Chen, Si[1];  Jiang, Di[2];  Ye, Lilei[3];  Liu, Johan[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30 Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), 2014-08-12 作者:  Sitek, Janusz[1];  Koscielski, Marek[2];  Zhang, Yan[3];  Fan, Jing-Yu[4];  Ma, Shiwei[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 Electrically conductive adhesives  nano additives  mechanical properties  reliability of interconnects  printed electronics   A new solder matrix nano polymer composite for thermal management applications 期刊论文 COMPOSITES SCIENCE AND TECHNOLOGY, 2014, 卷号: 94, 页码: 54-61 作者:  Zanden, Carl[1];  Luo, Xin[2];  Ye, Lilei[3];  Liu, Johan[4] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30 Metal matrix composites (MMCs)  Nano composites  Thermomechanical properties  Electrospinning  Liquid metal infiltration   Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation applications 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 卷号: 25, 页码: 2333-2338 作者:  Luo, Xin[1];  Zhang, Yong[2];  Zanden, Carl[3];  Murugesan, Murali[4];  Cao, Yu[5] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/30 CHEMICALLY VAPOR DEPOSITED CARBON NANOTUBES FOR VERTICAL ELECTRONICS INTERCONNECT IN PACKAGING APPLICATIONS 会议论文 IEEE International Conference on Solid-State and Integrated Circuit Technology, 2014-10-28 作者:  Liu, Johan[1];  Fu, Yifeng[2];  Jiang, Di[3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/30