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浏览/检索结果: 共117条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 A Universal Reference Line-Based Differential Phase Shifter Structure with Simple Design Formulas (EI收录) 期刊论文 IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 卷号: 7, 页码: 123-130 作者:  Xu, Bo Wei[1];  Zheng, Shao Yong[1];  Pan, Yong Mei[2];  Huang, Yi Hua[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Bandwidth  Phase shift   Effect of ultrasound on copper filling of high aspect ratio through-silicon via (TSV) (EI收录) 期刊论文 Journal of the Electrochemical Society, 2017, 卷号: 164 作者:  Xiao, Hongbin[1,2];  Wang, Fuliang[1,2];  Wang, Yan[1,2];  He, Hu[1,2];  Zhu, Wenhui[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/24 Aspect ratio  Copper  Electronics packaging  Filling  Integrated circuit manufacture  Ultrasonics   Preparation and properties of vinylphenyl-silicone resins and their application in LED packaging (EI收录) 期刊论文 RSC Advances, 2016, 卷号: 6, 页码: 71924-71933 作者:   收藏  |  浏览/下载：3/0  |  提交时间：2019/04/24 Condensation  Curing  Electronics packaging  Fourier transform infrared spectroscopy  High resolution transmission electron microscopy  High temperature applications  High temperature operations  Magnetic resonance spectroscopy  Nuclear magnetic resonance spectroscopy  Resins  Silicones  Temperature  Thermodynamic stability  Thermogravimetric analysis  Transmission electron microscopy   Microwave and Millimeter-Wave LTCC Filters Using Discriminating Coupling for Mode Suppression (EI收录SCI收录) 期刊论文 IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 卷号: 6, 页码: 272-281 作者:  Guo, Qing-Yi[1];  Zhang, Xiu Yin[1];  Gao, Li[2];  Li, Yuan Chun[1];  Chen, Jian-Xin[3] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/24 Bandpass filters  Microelectronics  Millimeter waves  Temperature   An analytical model of thermal mechanical stress induced by through silicon via (EI收录) 期刊论文 Chinese Physics B, 2015, 卷号: 24 作者:  Dong, Gang[1];  Shi, Tao[1];  Zhao, Ying-Bo[1];  Yang, Yin-Tang[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/25 Analytical models  Diffusion barriers  Electronics packaging  Finite element method  Integrated circuit interconnects  Integrated circuit manufacture  Silicon  Silicon oxides  Stresses  Thermal expansion   Plastic-silicon bonding for MEMS packaging application (CPCI-S收录) 会议论文 ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS 作者:  Lou, Xia[1];  Li, Zhihong[2];  Jin, Yufeng[1,2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/18 Study on the packaging technology for a high-G MEMS accelerometer (CPCI-S收录) 会议论文 PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2 作者:  Lou, X;  Shi, JJ;  Zhang, W;  Jin, YF 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/18 The evaluation of wafer thinning and singulating processes to enhance chip strength (EI收录) 会议论文 Proceedings - Electronic Components and Technology Conference, Lake Buena Vista, FL, United states, May 31, 2005 - June 4, 2005 作者:  Chen, Shoulung[1];  Kuo, Tzu-Ying[1];  Hu, Hsu-Tien[1];  Lin, Jyh-Rong[1];  Yu, Shan-Pu[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/18 Electronics packaging  Microprocessor chips  Radio systems  Semiconductor device manufacture  Standards  Thickness measurement   Evolution of AuSnx intermetallic components in laser reflowed right-angled solder joints during isothermal aging process (CPCI-S收录) 会议论文 ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS 作者:  Wei, Liu[1];  Wang Chunqing[1];  Tian Yanhong[1];  Li Mingyu[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/18 Analysis of error in measurement during destructive double bond pull test (EI收录) 会议论文 ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings, Shanghai, China, October 28, 2003 - October 30, 2003 作者:  Huang, Qiang[1];  Liu, Ying[1];  Guo, Daqi[1];  Ding, Rongzheng[1];  Zhang, Guohua[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/19 Bonding  Electronics packaging  Error analysis  Error correction  Force measurement  Hooks  Microelectronics  Packaging  Position measurement  Testing  Wire