| The evaluation of wafer thinning and singulating processes to enhance chip strength (EI收录) | |
| Chen, Shoulung[1]; Kuo, Tzu-Ying[1]; Hu, Hsu-Tien[1]; Lin, Jyh-Rong[1]; Yu, Shan-Pu[1] | |
| 会议名称 | Proceedings - Electronic Components and Technology Conference |
| 会议日期 | May 31, 2005 - June 4, 2005 |
| 会议地点 | Lake Buena Vista, FL, United states |
| 关键词 | Electronics packaging Microprocessor chips Radio systems Semiconductor device manufacture Standards Thickness measurement |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2118426 |
| 专题 | 华南理工大学 |
| 作者单位 | [1] Electronics Research and Service Organization[ERSO], Industrial Technology Research Institute[ITRI], China |
| 推荐引用方式 GB/T 7714 | Chen, Shoulung[1],Kuo, Tzu-Ying[1],Hu, Hsu-Tien[1],等. The evaluation of wafer thinning and singulating processes to enhance chip strength (EI收录)[C]. 见:Proceedings - Electronic Components and Technology Conference. Lake Buena Vista, FL, United states. May 31, 2005 - June 4, 2005. |
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